-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
BTU to Showcase Its Solder Reflow Flux Management System at SMTconnect
April 22, 2022 | BTU International, Inc.Estimated reading time: 1 minute

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced plans to exhibit at SMTconnect, scheduled to take place May 10-12, 2022 in Nuremberg. The company will highlight its Aqua Scrub Flux Management Technology and PYRAMAX reflow oven in exhibit with BTU’s distributor, Stratus Vision, Hall 4A, Stand 411.
BTU has recently expanded the distribution territory of Stratus Vision to include Germany, Austria and Switzerland for Pyramax reflow ovens. Stratus Vision has been a long-time partner and distributor of BTU high temperature belt furnaces.
Aqua Scrub Technology is BTU’s next-generation solder reflow flux management system. The patent-pending design uses an aqueous-based scrubber technology compatible with most known paste and flux types. The flux and solution are automatically contained and packaged for disposal.
The Aqua Scrub is purpose-built as a stand-alone system that can be easily retrofitted on PYRAMAX reflow ovens already in the field as well as being configured on new PYRAMAX ovens. This self-contained unit mounts on the back side of the oven to minimize the impact on oven operation and factory floor space.
In addition to a very attractive cost of ownership, Aqua Scrub is designed to decrease operational cost by 4X compared to traditional condensation systems. The reduction in cost can be attributed to reduced downtime, labor and disposal costs.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.