-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
ViTrox Kick off 2022 with User Group Meeting (UGM) in Mexico
April 22, 2022 | ViTrox TechnologiesEstimated reading time: 1 minute

ViTrox Technologies, the most trusted vision inspection solutions provider to the PCBA SMT Assembly and Semiconductor industry, is pleased to announce that we will be conducting the User Group Meeting (UGM) 2022 in Mexico on 12 May 2022 from 1:30 PM - 7:00 PM (CST) at Guadalajara, Mexico.
With the heart to remain the aspiration of being the most trusted technology company, ViTrox aims to provide top-notch quality service and support worldwide customers. We are delighted to announce that ViTrox is partnering with SMTo Engineering, ViTrox's Sales Channel Partner (SCP), to host the upcoming UGM 2022 in Guadalajara, Mexico. Besides, the UGM is the communication platform for our SCPs to network and exchange exciting user experiences to further strengthens the skills to provide the best service support to our customers.
The main theme of UGM 2022 Mexico is to showcase our Smart One-stop Solutions covering Advanced 3D Solder Paste Inspection (API) System, Advanced 3D Optical Inspection (AOI) System, Advanced 3D X-Ray Inspection (AXI) System, Advanced Robotic Vision (ARV) System and Industry 4.0 Smart Solution V-ONE®. During UGM, we will demonstrate the Smart One-stop Solutions to our audience how our Solutions can enhance your production to a whole new level with optimal production efficiency and high throughput. Besides, the audience can also get the latest information from our exclusive market technology sharing sessions.
Beyond that, we also have another good news for our worldwide customers. As we are expanding our market presence in Mexico, we are thrilled to announce that ViTrox and SMTo will be adding a new demo room in Tijuana, Mexico. The new demo room will have the whole SMT line solution ready to demo for our customers in the Tijuana region. Stay tuned for our new demo room, which we will be launching the soft opening in June 2022.
While the pandemic has created challenges for the global economy, we are optimistic about having our international team of Sales Channel Partners (SCP). With over 20 years of robust sales and technical experience in the PCB SMT assembly industry, SMTo Engineering (SMTo) and its group of elites provide high-quality consulting and support services in the electronics manufacturing market in Mexico. We are grateful to partner with SMTo, and we are delighted to set another record high sales revenue in Mexico in 2021.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.