Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
Call For Papers For IPC APEX EXPO 2023
April 25, 2022 | IPCEstimated reading time: 1 minute
The newly appointed IPC APEX EXPO Technical Program Committee (TPC) is inviting engineers, researchers, academics, technical experts, and industry leaders to submit technical conference abstracts for IPC APEX EXPO 2023 to be held at the San Diego Convention Center. The technical conference will take place January 24–26, 2023.
“The TPC – comprised of top technical leadership and subject matter experts from across the electronics industry – continues to build and strengthen the IPC APEX EXPO technical conference. A new committee chair and co-chair are leading the group through process improvements with a focus to provide stronger technical content spanning various technologies and the supply chain,” said Matt Kelly, IPC chief technologist. “The TPC’s mission is to deliver strong, relevant, and valuable technical programming that balances conventional technology advances with next-generation disruptive technologies. With these upgrades to the TPC, I’m excited to see what the IPC APEX EXPO 2023 technical conference has in store.”
Led by Stanton Rak, Ph.D., SF Rak Co. (Chair) and Udo Welzel, Ph.D., Robert Bosch GmbH (Co-Chair), the committee comprises the following members: Beverley Christian, Ph.D., HDP User Group; Bhanu Sood, Ph.D., NASA Goddard Space Flight Center; Eric Campbell, IBM; Hans-Peter Tranitz, Ph.D., Continental Automotive GmbH; Jason Keeping, Celestica Inc.; Kelly Scanlon, IPC; Martin Goetz, Northrop Grumman Corporation; Matt Kelly, IPC; Michael Ford, Aegis Industrial Software; Michael Carano; Milos Lazic, Indium Corporation; Paige Fiet, TTM Technologies, Inc.; Paul Cooke, Asahi Glass Co. Ltd.; Radu Diaconescu, Swissmic SA; Robert Kinyanjui, Ph.D., John Deere Electronic Solutions; Sarah Czaplewski-Campbell, IBM; Tim Burke, Ph.D., Arch Systems Inc.; Todd MacFadden, Bose Corporation; Laura Cohen, Ph.D., Continental Automotive; John Bauer, Collins Aerospace.
Technical conference paper and poster abstracts are due Monday, June 20, 2022. IPC seeks abstracts summarizing original and previously unpublished work describing significant results from research experiments, highlighting new techniques or materials, and/or discussing cutting-edge trends and challenges facing the electronics manufacturing industry.
Share on:
Suggested Items
AirBorn Announces Agreement to be Acquired by Molex
11/18/2024 | PRNewswireAirBorn, a global manufacturer of high reliability electronics and components, announced it has entered into an agreement to be acquired by Molex, a leading global connectivity and electronics solutions provider.
RTX's Collins Aerospace to Provide UK Chinook Helicopters with Interoperable Avionics System
11/12/2024 | RTXCollins Aerospace, an RTX business, has received a $19 million contract from the Department of Defense to equip a fleet of new H-47 Chinooks for the UK Royal Air Force with its Common Avionics Architecture System (CAAS) avionics management suite.
Lockheed Martin Skunk Works, the Royal Netherlands Aerospace Centre (NLR) Announce Strategic Collaboration
10/21/2024 | Lockheed MartinSkunk Works®, the renowned advanced development organization within Lockheed Martin Corporation and the Royal Netherlands Aerospace Centre (NLR), a premier knowledge institute and connecting link among science, industry, and government in the Netherlands, announced a strategic collaboration to advance mutual interests for enhanced security at the Netherlands Defense Industry Days event.
Altair Drives Aerospace Innovation at Motivo
10/17/2024 | AltairAltair, a global leader in computational intelligence, is proud to announce its collaboration with Motivo, a product engineering firm focused on translating forward-thinking visions into best-in-class products for clients in the mobility, energy, agriculture technology, and aerospace sectors. Motivo utilizes Altair’s unique combination of engineering consulting and software to drive innovation for organizations in the aerospace industry.
Airbus, Toshiba to Partner on Superconductivity Research
10/16/2024 | AirbusAirbus UpNext, a wholly-owned subsidiary of Airbus, and Toshiba Energy Systems & Solutions Corporation (Toshiba), Toshiba Group’s energy arm, will cooperate and mutualise experience on superconducting technologies for future hydrogen-powered aircraft.