Global Sourcing Spotlight: Tariffs—The New Reality
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Koh Young Technology Celebrates 20 Years of Innovation
May 3, 2022 | Koh Young TechnologyEstimated reading time: 1 minute
Originating from a passionate team of ten engineers, Koh Young Technology has flourished into the industry leader of True 3D measurement-based inspection solutions. May 2022 will see us celebrate 20 years of innovation! “From being a newcomer in the inspection industry to the global leader in the SPI market took us just three years. This accomplishment is – without doubt – thanks to our team, our customers, and our partners,” reflects Dr. Kwangill Koh, Founder and CEO of Koh Young Technology.
Back in the early 2000s, machines were not dependable enough to inspect printed solder paste or mounted components, so a human worker had to sit at the line, stare at each solder brick and component on a board, and then identify defects with their eyes under a Logo
Description automatically generated magnifying lens. The industry had to replace this manual process with an inspection machine designed with enough software intelligence to substitute a human mind with more accuracy than the human eye. Now, our 3D inspection systems are the de facto standard for inspection and have revolutionized the electronics manufacturing industry.
During our climb to the zenith of the inspection market, we achieved several notable accomplishments along the way. Some of Dr. Koh’s most memorable events include:
- Shifting the inspection market paradigm in 2003 with our 3D solder paste inspection (SPI) system
- Overcoming impossible hurdles to invent 3D automated optical inspection (AOI) in 2010
- Creating the industry’s first A.I. (artificial intelligence) technology that helped build the ultimate smart factory of the future, all the while developing our foray into semiconductor and advanced packaging inspection solutions with the Meister Series in 2017
- Developing the industry’s first in-line dispensing process inspection system in 2021 (Neptune) to inspect the thickness of conformal coating as well as any transparent materials in 2021
“Inventing an innovative technology and shifting an industry paradigm is not a road often taken, yet Koh Young will gladly hop on the path,” commented Dr. Koh. “The unyielding commitment and fighting spirit required to take such paths are in our DNA.”
Additional content from Koh Young:
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series
- You can also view other titles in our full I-007e book library here
Share on:
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.