Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
American Made Advocacy: Where’s the Budget for a Modern Military Run on Microelectronics?
Summit Interconnect Acquires Royal Circuit Solutions and Affiliates
May 4, 2022 | Summit Interconnect, Inc.Estimated reading time: 2 minutes
Summit Interconnect is pleased to announce the acquisition of Royal Circuit Solutions with California operations in Hollister and Santa Ana and affiliate Advanced Assembly located in Aurora, Colorado. The acquisition expands Summit’s PCB offering in rigid, flex, rigid-flex and ATE PCBs, significantly strengthens engineering and service resources providing CAM, DFM/A, PCB design/layout, and also adds quick-turn, prototype SMT assembly services.
The combined company will provide best-in-industry use of software applications that integrate and automate engineering, stack ups, quoting, production management and customer interface. This highly developed platform will significantly improve speed and service to our valued customers.
Shane Whiteside, President and CEO of Summit Interconnect, Inc. stated, “This combination aligns the Royal and Advanced quick-turn, vertically integrated model with Summit’s differentiated production capabilities. Each entity brings capabilities to the Summit portfolio that will further strengthen our ability to serve our customers in both high-performance commercial and defense markets, as well as broaden our relationships into additional sectors. This is a very exciting milestone for Summit, Royal Circuits and Advanced Assembly and we welcome our new employees to the Summit team.”
Milan Shah, Owner and CEO of Royal Circuits commented, “We are very excited to align ourselves with the tremendous team at Summit and bring our automated software-powered approach to the Summit organization. Together, we will continue to build and scale a world-class company delivering technology solutions to solve the most complex printed circuit board challenges across all end markets.”
About Summit Interconnect: Summit Interconnect is a leading provider of complex printed circuit boards focused on fast growing defense and high-performance commercial sectors in the North American market. Summit offers solutions ranging from advanced cutting-edge prototyping to complex high mix, low-to-mid volume production. Summit’s facilities are located across California, Illinois, Colorado and Toronto, Canada. For more information, please visit: summit-pcb.com
About Royal Circuit Solutions: Established in 1998 and headquartered in Hollister, CA, Royal is one of North America’s leading providers of quick-turn, advanced technology prototype printed circuit boards. Royal provides customers across the industrial, medical, automotive, consumer, semiconductor, datacom and space markets with technology driven printed circuits in hours, not days. For more information, please visit: royalcircuits.com
About Advanced Assembly: For nearly twenty years, Advanced has helped engineers assemble PCBs in three days or less. Offering a full-range of manufacturing services for prototypes and low volume quantities. Advanced Assembly delivers at the speed of imagination. For more information, please visit: aapcb.com
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Indium Corporation Earns Mexico Technology Award for New Halogen-Free Flux-Cored Wire
09/18/2025 | Indium CorporationIndium Corporation recently earned a Mexico Technology Award for its new high-reliability, halide- and halogen-free flux-cored wire, CW-807RS, which improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure
09/17/2025 | BUSINESS WIREBlaize Holdings, Inc., a leader in programmable, energy-efficient edge AI computing, and Technology Control Company (TCC), a leading technology solutions provider in the Kingdom of Saudi Arabia (KSA), announced a strategic partnership to advance Saudi Arabia’s AI innovation infrastructure and accelerate its digital transformation goals.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).