Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
Summit Interconnect Acquires Royal Circuit Solutions and Affiliates
May 4, 2022 | Summit Interconnect, Inc.Estimated reading time: 2 minutes
Summit Interconnect is pleased to announce the acquisition of Royal Circuit Solutions with California operations in Hollister and Santa Ana and affiliate Advanced Assembly located in Aurora, Colorado. The acquisition expands Summit’s PCB offering in rigid, flex, rigid-flex and ATE PCBs, significantly strengthens engineering and service resources providing CAM, DFM/A, PCB design/layout, and also adds quick-turn, prototype SMT assembly services.
The combined company will provide best-in-industry use of software applications that integrate and automate engineering, stack ups, quoting, production management and customer interface. This highly developed platform will significantly improve speed and service to our valued customers.
Shane Whiteside, President and CEO of Summit Interconnect, Inc. stated, “This combination aligns the Royal and Advanced quick-turn, vertically integrated model with Summit’s differentiated production capabilities. Each entity brings capabilities to the Summit portfolio that will further strengthen our ability to serve our customers in both high-performance commercial and defense markets, as well as broaden our relationships into additional sectors. This is a very exciting milestone for Summit, Royal Circuits and Advanced Assembly and we welcome our new employees to the Summit team.”
Milan Shah, Owner and CEO of Royal Circuits commented, “We are very excited to align ourselves with the tremendous team at Summit and bring our automated software-powered approach to the Summit organization. Together, we will continue to build and scale a world-class company delivering technology solutions to solve the most complex printed circuit board challenges across all end markets.”
About Summit Interconnect: Summit Interconnect is a leading provider of complex printed circuit boards focused on fast growing defense and high-performance commercial sectors in the North American market. Summit offers solutions ranging from advanced cutting-edge prototyping to complex high mix, low-to-mid volume production. Summit’s facilities are located across California, Illinois, Colorado and Toronto, Canada. For more information, please visit: summit-pcb.com
About Royal Circuit Solutions: Established in 1998 and headquartered in Hollister, CA, Royal is one of North America’s leading providers of quick-turn, advanced technology prototype printed circuit boards. Royal provides customers across the industrial, medical, automotive, consumer, semiconductor, datacom and space markets with technology driven printed circuits in hours, not days. For more information, please visit: royalcircuits.com
About Advanced Assembly: For nearly twenty years, Advanced has helped engineers assemble PCBs in three days or less. Offering a full-range of manufacturing services for prototypes and low volume quantities. Advanced Assembly delivers at the speed of imagination. For more information, please visit: aapcb.com
Share on:
Suggested Items
Nokia, Honeywell Aerospace Technologies Partner with Numana to Advance Quantum-safe Networks
04/01/2025 | HoneywellNokia and Honeywell Aerospace Technologies announced a strategic partnership with Numana to advance Quantum-Safe Networks (QSN) in Montreal, Canada, and worldwide.
European Chips Skills Academy Launches ECS Summer School 2025 to Inspire Future Electronics Talent
04/01/2025 | JCN NewswireThe European Chips Skills Academy (ECSA), an EU-funded project coordinated by SEMI Europe, in collaboration with industry partners AENEAS, EPoSS, and INSIDE, has announced the launch of the ECS Summer School 2025.
Real Time with... IPC APEX EXPO 2025: Highlighting Global PCB Trends and Technologies with all4-PCB
04/01/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy and all4-PCB's Ralph Jacobo discuss global distribution trends in the PCB industry, focusing on new technologies in plasma etching and final inspection. Ralph highlights the importance of IC substrate buildup technology and partnerships in the market.
Incap Launches ‘Incap Legends’ esports Tournament and Invites Students from Around the World to Participate
03/31/2025 | IncapIncap Corporation is proud to announce the launch of ‘Incap Legends’, a new esports tournament in partnership with Newcastle and Stafford Colleges Group (NSCG).
Foxconn Chairman Young Liu to Deliver Keynote at COMPUTEX 2025
03/28/2025 | PRNewswireTAITRA (Taiwan External Trade Development Council), announced that Young Liu, Chairman of Hon Hai Technology Group (Foxconn), is invited to be the speaker at COMPUTEX 2025 Keynote, sharing his vision on three intelligent platforms driving industry transformation and the role of robotics in factories of the future.