The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Summit Interconnect Acquires Royal Circuit Solutions and Affiliates
May 4, 2022 | Summit Interconnect, Inc.Estimated reading time: 2 minutes
Summit Interconnect is pleased to announce the acquisition of Royal Circuit Solutions with California operations in Hollister and Santa Ana and affiliate Advanced Assembly located in Aurora, Colorado. The acquisition expands Summit’s PCB offering in rigid, flex, rigid-flex and ATE PCBs, significantly strengthens engineering and service resources providing CAM, DFM/A, PCB design/layout, and also adds quick-turn, prototype SMT assembly services.
The combined company will provide best-in-industry use of software applications that integrate and automate engineering, stack ups, quoting, production management and customer interface. This highly developed platform will significantly improve speed and service to our valued customers.
Shane Whiteside, President and CEO of Summit Interconnect, Inc. stated, “This combination aligns the Royal and Advanced quick-turn, vertically integrated model with Summit’s differentiated production capabilities. Each entity brings capabilities to the Summit portfolio that will further strengthen our ability to serve our customers in both high-performance commercial and defense markets, as well as broaden our relationships into additional sectors. This is a very exciting milestone for Summit, Royal Circuits and Advanced Assembly and we welcome our new employees to the Summit team.”
Milan Shah, Owner and CEO of Royal Circuits commented, “We are very excited to align ourselves with the tremendous team at Summit and bring our automated software-powered approach to the Summit organization. Together, we will continue to build and scale a world-class company delivering technology solutions to solve the most complex printed circuit board challenges across all end markets.”
About Summit Interconnect: Summit Interconnect is a leading provider of complex printed circuit boards focused on fast growing defense and high-performance commercial sectors in the North American market. Summit offers solutions ranging from advanced cutting-edge prototyping to complex high mix, low-to-mid volume production. Summit’s facilities are located across California, Illinois, Colorado and Toronto, Canada. For more information, please visit: summit-pcb.com
About Royal Circuit Solutions: Established in 1998 and headquartered in Hollister, CA, Royal is one of North America’s leading providers of quick-turn, advanced technology prototype printed circuit boards. Royal provides customers across the industrial, medical, automotive, consumer, semiconductor, datacom and space markets with technology driven printed circuits in hours, not days. For more information, please visit: royalcircuits.com
About Advanced Assembly: For nearly twenty years, Advanced has helped engineers assemble PCBs in three days or less. Offering a full-range of manufacturing services for prototypes and low volume quantities. Advanced Assembly delivers at the speed of imagination. For more information, please visit: aapcb.com
Share on:
Suggested Items
Green Tech Accelerator: Tackling Water Resource Challenges and Unlocking Renewable Energy Opportunities
12/26/2024 | BUSINESS WIREGreen Tech Accelerator collaborates with startups, offering courses, mentorship, and international market strategies to implement and validate carbon reduction solutions. This Taiwanese initiative empowers SMEs to progress toward net-zero emissions.
Compal Adopts Intel Tech for Innovative Liquid Cooling Solutions
12/26/2024 | Compal Electronics Inc.Compal Electronics, a leading server solution provider, announced today its collaboration with Intel, BP Castrol (Castrol), JWS, and Priver to launch a groundbreaking liquid cooling solution based on Intel’s Targeted Flow technology. Designed specifically for high-density servers and AI data centers, this innovative solution aims to drive the industry toward a more efficient and sustainable future.
Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.
12/25/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc., up to $407 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
SMT Mounter Market Size Projected to Reach $5.06 Billion by 2030
12/23/2024 | openPRAccording to the new market research report "Global SMT (Surface-mount Technology) Mounter Market Report 2024-2030", published by QYResearch, the global SMT (Surface-mount Technology) Mounter market size is projected to reach USD 5.06 billion by 2030, at a CAGR of 4.7% during the forecast period.
Apple’s Vision Pro Reshapes the VR/MR Landscape, Driving Applications from Entertainment to Productivity Tools
12/23/2024 | TrendForceTrendForce’s latest report estimates that global shipments of VR and MR headsets are expected to reach approximately 9.6 million units in 2024, representing a YoY increase of 8.8%.