Driving Innovation: Inner Layer Alignment Methods in PCB Production
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
It’s Only Common Sense: Sales as a Team Sport
Fairview Microwave Releases 5G Outdoor-rated Omnidirectional Antennas
May 5, 2022 | Fairview MicrowaveEstimated reading time: 1 minute
Fairview Microwave Inc., an Infinite Electronics brand and a leading provider of on-demand RF, microwave and millimeter wave components, has just released a new series of 5G outdoor-rated omnidirectional antennas that cover 4G, 5G, LTE and CBRS bands.
These small form factor omni antennas are the perfect solution when broad coverage is required but traditional base station antennas are too bulky or expensive. They support 6, 7, 8 and 10 dBi gain and are also offered with fiberglass radomes (PRO series).
Fairview’s new 5G omni antennas offer range extension and simple deployment to build out WLAN and cellular communications networks as well as private networks. They also include heavy-duty steel mast mounting brackets for rapid deployment and feature low-cost polycarbonate or ABS options. The antennas’ rugged polycarbonate and fiberglass radomes withstand extreme weather and are rated to over 120 mph wind loading.
These collinear omnidirectional antennas feature Type-N connectors and are suitable for SISO or MIMO operation. Additionally, models that support 2x2 and 4x4 MIMO configurations ensure double and quadruple data speeds in comparison to single-input antennas.
“We’ve designed our new line of 5G omni antennas to cover all of your wireless networking needs. This includes broad coverage for rural areas and other areas that are typically difficult to cover. Not only are they technically superior to traditional base station antennas, they’re also economical and highly reliable,” said Kevin Hietpas, Antenna Product Line Manager.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
LQDX Inc. Completes Sale of Aluminum Clad Laminate IP to Toyo Aluminium K.K.
07/31/2025 | PR NewswireLQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has completed the divestiture of its Aluminum Clad Laminate IP – known as ACL™ – to Toyo Aluminium K.K., a Japan-based global market leader in specialty aluminum-based products for the consumer, electronics and automotive sectors.
Clear Demand Signal Needed for CHIPS Success
08/01/2025 | I-Connect007 Editorial TeamIn July, the National Defense Industrial Association’s (NDIA) Electronics Division released a white paper titled "Clear Demand Signal Needed for CHIPS Success." The paper highlights the importance of the CHIPS and Science Act’s $52 billion investment in revitalizing secure domestic semiconductor production, but also raises the alarm that the Act mainly addresses supply challenges and has not established mechanisms to ensure ongoing demand for U.S.-based microelectronics production.
Japan’s OHISAMA Project Aims to Beam Solar Power from Space This Year
07/14/2025 | I-Connect007 Editorial TeamJapan could be on the cusp of making history with its OHISAMA project in its quest to become the first country to transmit solar power from space to Earth, The Volt reported.
Cetec ERP Expands into Larger Office to Support Continued Growth
07/11/2025 | Cetec ERPCetec ERP, a leading provider of cloud-based ERP software for manufacturers, has officially relocated to a larger, modern office facility in central Austin as of July 2, 2025.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.