Dan’s Biz Bookshelf: 'This Is Strategy: Make Better Plans'
The Chemical Connection: Reducing Defects in Circuit Board Production
It’s Only Common Sense: Trust Is All You Need
Fairview Microwave Releases 5G Outdoor-rated Omnidirectional Antennas
May 5, 2022 | Fairview MicrowaveEstimated reading time: 1 minute
Fairview Microwave Inc., an Infinite Electronics brand and a leading provider of on-demand RF, microwave and millimeter wave components, has just released a new series of 5G outdoor-rated omnidirectional antennas that cover 4G, 5G, LTE and CBRS bands.
These small form factor omni antennas are the perfect solution when broad coverage is required but traditional base station antennas are too bulky or expensive. They support 6, 7, 8 and 10 dBi gain and are also offered with fiberglass radomes (PRO series).
Fairview’s new 5G omni antennas offer range extension and simple deployment to build out WLAN and cellular communications networks as well as private networks. They also include heavy-duty steel mast mounting brackets for rapid deployment and feature low-cost polycarbonate or ABS options. The antennas’ rugged polycarbonate and fiberglass radomes withstand extreme weather and are rated to over 120 mph wind loading.
These collinear omnidirectional antennas feature Type-N connectors and are suitable for SISO or MIMO operation. Additionally, models that support 2x2 and 4x4 MIMO configurations ensure double and quadruple data speeds in comparison to single-input antennas.
“We’ve designed our new line of 5G omni antennas to cover all of your wireless networking needs. This includes broad coverage for rural areas and other areas that are typically difficult to cover. Not only are they technically superior to traditional base station antennas, they’re also economical and highly reliable,” said Kevin Hietpas, Antenna Product Line Manager.
Share on:
Suggested Items
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.
HBM4 Raises the Bar on Manufacturing Complexity, Premium Expected to Exceed 30%
05/22/2025 | TrendForceTrendForce's latest findings reveal that demand for AI servers continues to accelerate the development of HBM technologies, with the three major suppliers actively advancing their HBM4 product roadmaps.
Zuken Launches CR-8000 2025 with AI-Enhanced Support for High-Speed, High-Density PCB Design
05/21/2025 | ZukenZuken, a global leader in electronic design automation (EDA) solutions, has announced the release of the 2025 updates to its flagship PCB design applications, CR-8000 Design Gateway and Design Force.
Infineon Gains Approval of Science Based Targets Initiative for Ambitious CO2 Emission Reduction Targets
05/20/2025 | InfineonInfineon Technologies AG has reached another milestone in its decarbonization efforts: The Science Based Targets initiative (SBTi) has approved the company's ambitious greenhouse gas emission reduction targets.
NY CREATES, Fraunhofer Institutes Announce Joint Development Agreement to Advance Memory Devices at the 300mm Wafer Scale
05/16/2025 | NY CREATESNY CREATES and Fraunhofer IPMS announced at a signing ceremony a new Joint Development Agreement (JDA) to drive research and development focused on memory devices.