-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC, ITI to Host Virtual Conference on Critical and Emerging Environmental Product Requirements
May 10, 2022 | IPCEstimated reading time: 1 minute

IPC and the Information Technology Industry Council (ITI) will host a virtual conference, “Critical and Emerging Environmental Product Requirements” on June 7 from 11:00 a.m. to 3:30 p.m. EDT. The event will explore the latest environmental requirements that impact product design, manufacturing, supply chain management, and technology innovation.
Speakers include leading environmental regulatory experts Liz Moorman from the U.K. Department for Environment, Food and Rural Affairs (DEFRA); Peter Alcock from the U.K. Department for Business, Energy & Industrial Strategy (BEIS); Ana Corado and Tala Henry from the ?U.S. Environmental Protection Agency (EPA); and Kevin Wolfe from Intel.
Alcock and Moorman will cover U.K. Restriction of Hazardous Substances (RoHS) regulations. Corado will present on Toxic Substances Control Act (TSCA) risk evaluations and risk management. Henry will cover EPA’s actions to address to per- and polyfluoroalkyl substances (PFAS) and Wolfe will discuss industry collaboration on PFAS.
“Existing chemical and product requirements are evolving and, in addition, we see newly emerging requirements. Combined, these make it difficult to stay ahead of what is needed in terms of compliance,” said Kelly Scanlon, IPC director of environmental policy and research. “Misunderstanding these ever-changing requirements could have a disastrous impact for business. ITI and IPC’s virtual conference will provide the information compliance professionals and officers need to be up to date with legal, regulatory, and customer requirements.”
“Environmental compliance regulations across the globe continue to evolve,” said Chris Cleet, ITI vice president of policy, environment and sustainability. “This conference will give companies a unique opportunity to hear directly from government officials and experts about the current policy landscape and provide critical information and resources compliance professionals need to effectively navigate new regulations and stay ahead of future changes.”
The event is sponsored by The Compliance Map, Orbis Compliance, GreenSoft Technology, Inc., Source Intelligence, and S&P Global Engineering Solutions.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure
09/17/2025 | BUSINESS WIREBlaize Holdings, Inc., a leader in programmable, energy-efficient edge AI computing, and Technology Control Company (TCC), a leading technology solutions provider in the Kingdom of Saudi Arabia (KSA), announced a strategic partnership to advance Saudi Arabia’s AI innovation infrastructure and accelerate its digital transformation goals.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Altair, Wichita State University’s NIAR Sign MoU to Accelerate Aerospace Innovation
09/16/2025 | AltairAltair, a global leader in computational intelligence, and Wichita State University’s (WSU) National Institute for Aviation Research (NIAR), one of the world’s leading aerospace research institutions, have signed a memorandum of understanding (MoU) to advance innovation across the aerospace and defense industries.