Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
Ventec to Host Live Webinar on Thermal Management with IMS
May 12, 2022 | VentecEstimated reading time: 1 minute
Ventec International Group Co., Ltd. (6672 TT) is pleased to announce that it will be hosting a live webinar on ‘Top design techniques for thermal management with IMS’ on Thursday, June 23 at 3:00 p.m. CET / 9:00 a.m. EST. Presented by IMS technology expert Robert Art, the webinar is geared towards helping PCB Designers, OEMs and PCB Manufacturers optimize the thermal performance, reliability, and quality of their designs with high-performance IMS materials.
Insulated metal substrate (IMS) technology provides an elegant and economical solution for managing component temperatures in electronic applications such as computing, lighting, and power supplies for a wide range of markets and environments. Identifying a suitable IMS to maintain components at a desired operating temperature enables engineers to design products that enjoy several advantages in the marketplace:
- Superior reliability
- Smaller size
- Attractive appearance
- Competitive price
Ventec’s free webinar on thermal management with IMS will review popular applications, provide top tips and best practices on IMS material selection and the options that are available to help designers and engineers overcome thermal-management challenges and achieve the thermal performance needed to achieve their targets.
Date: Thursday, 23rd June 2022
Time: 3:00 p.m. (CET) / 9:00 a.m. (EST)
To register, click here.
For more information about Ventec's solutions and the company’s wide variety of products, please visit www.venteclaminates.com.
Share on:
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).