It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Marcy’s Musings: The Legislative Outlook—Helping or Hurting?
iNEMI's End-of-Project Webinar: 1st Level Interconnect Void Characterization Project, Phase 2
May 23, 2022 | iNEMIEstimated reading time: 1 minute
Phase 2 of the 1st Level Interconnect Void Characterization project focused on understanding the potentially adverse impact that voids in first level interconnect materials have on the reliability of the electrical interconnect. The formation of small voids can occur in solder-based flip chip joints during the assembly process. This can be a concern for applications that involve high electrical and thermal flux across flip chip packages because the presence of a void can accelerate complete open failure due to electromigration.
The project team conducted experiments to understand the relationship between voids and joint reliability (electrical and mechanical) and worked on recommendations for acceptable voiding characteristics for flip chip interconnects. This end-of-project webinar will present the reliability test results for first level interconnection — performed by electromigration, temperature cycle and thermal shock testing — and will include descriptions of the test packages, reliability test conditions, test data of cross-section images and EBSD data.
Registration
This webinar is open to industry; advance registration is required, check iNEMI's website. Two webinars with the same content are scheduled — please join whichever one fits your schedule.
Session 1 (APAC)
Thursday, June 16, 2022
10:00-11:00 a.m. JST (Japan)
9:00-10:00 p.m. EDT on June 15 (Americas)
Session 2 (Americas & Europe)
Thursday, June 16, 2022
9:00-10:00 a.m. EDT (Americas)
3:00-4:00 p.m. CEST (Europe)
10:00-11:00 p.m. JST (Japan)
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.