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Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
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In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
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Indium's Andreas Karch to Present at Delsys Tech Day
May 24, 2022 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation’s Andreas Karch, technologist – advanced application and technical manager for Germany, Austria, and Switzerland, will present as part of Delsys Tech Day on Wednesday, June 22 in Lucerne, Switzerland.
Throughout the day, seven experts from across the electronics assembly industry will deliver a mix of lectures about high performance technologies and current trends in electronic production. Karch will present on Current and Future Requirements for Solder Pastes – Materials in Different Areas of Application.
Karch has more than 25 years of experience in automotive electronics and power electronics, including the development of advanced customized solutions. In 2014, the Austrian Patent Office awarded him the “Inventum” award for his patent for innovative LED automotive lighting as one of the top 10 applicants. He is an ECQA-certified development engineer and has earned the Six Sigma Yellow Belt.
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