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Indium's Andreas Karch to Present at Delsys Tech Day
May 24, 2022 | Indium CorporationEstimated reading time: Less than a minute

Indium Corporation’s Andreas Karch, technologist – advanced application and technical manager for Germany, Austria, and Switzerland, will present as part of Delsys Tech Day on Wednesday, June 22 in Lucerne, Switzerland.
Throughout the day, seven experts from across the electronics assembly industry will deliver a mix of lectures about high performance technologies and current trends in electronic production. Karch will present on Current and Future Requirements for Solder Pastes – Materials in Different Areas of Application.
Karch has more than 25 years of experience in automotive electronics and power electronics, including the development of advanced customized solutions. In 2014, the Austrian Patent Office awarded him the “Inventum” award for his patent for innovative LED automotive lighting as one of the top 10 applicants. He is an ECQA-certified development engineer and has earned the Six Sigma Yellow Belt.
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Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.