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For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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IPC Establishes European Subsidiary
May 25, 2022 | IPCEstimated reading time: Less than a minute
To better support our European members’ interests, IPC announces the formation of IPC Electronics Europe GmbH. The subsidiary was officially registered with the German government on May 4, 2022. The new entity’s main office is located in central Munich.
John W. Mitchell, IPC president and CEO commented, “While we have been actively engaged and successful in Europe for more than 30 years, having a legal entity here now enhances our ability to serve the regional electronics industry and our membership in newer and bolder ways with renewed vigor.”
“We are very excited about the prospects of actively participating in significant consortiums and working groups in the EU to help drive newer standards, education, and advocacy solutions that will be vital in transforming the continent’s factories of the future,” said Sanjay Huprikar, president of IPC in Europe and South Asia.
IPC has plans in place to expand staff in Europe in addition to Francisco Fourcade who joined IPC in April as electronics standards manager to liaise with the growing number of new standards development committees forming in Europe. The organization will be adding talent to the certification, marketing, and industry intelligence teams over the next 18 months.
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