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indie Semiconductor Introduces Class-leading Computer Vision Processor Family

06/28/2024 | BUSINESS WIRE
indie Semiconductor, Inc., an Autotech solutions innovator, announced the addition of a highly innovative iND880xx product line to its fast-growing vision processor portfolio, developed to address the demanding specifications of Advanced Driver Assistance Systems (ADAS) and driver viewing use cases, such as Surround View systems and Electronic Mirrors.

For Networking, Edge, and IoT Applications: Swissbit Expands PCIe Portfolio

06/27/2024 | Swissbit
Storage specialist Swissbit continues to strategically expand its PCIe offerings. The new N2000 (Gen3 PCIe) and N3000 (Gen4 PCIe) product families primarily address applications that require PCIe performance as well as a balanced ratio of low power consumption and reduced heat generation.

Indium Corporation’s New Type 6 Jetting Solder Paste Hits Market

06/26/2024 | Indium Corporation
Indium Corporation® is pleased to introduce a new jetting solder paste to join its PicoShot® series of products. PicoShot® NC-6M is a no-clean, halogen-free, Type 6 powder-size material specifically formulated to be compatible with Mycronic jetting systems and Mycronic’s “small dot” ejector.

Cadence Expands System IP Portfolio with Network on Chip to Optimize Electronic System Connectivity

06/26/2024 | Cadence Design Systems, Inc.
The Cadence Janus NoC manages these simultaneous high-speed communications efficiently with minimal latency, enabling customers to achieve their PPA targets faster and with lower risk.

Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for High-Performance Compute and AI Infrastructure

06/19/2024 | BUSINESS WIRE
Alphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, today announced the successful tape-out of the industry’s first off-the-shelf multi-protocol I/O connectivity chiplet on TSMC’s 7nm process.
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