Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Altus Looks Back at a Year of Essemtec Technology Success
May 27, 2022 | Altus GroupEstimated reading time: 1 minute
Since partnering with Essemtec a year ago, Altus Group, a leading distributor of capital equipment in the UK and Ireland, has seen great interest in the Swiss company’s unique range of highly flexible SMT pick and place and dispensing solutions, with sales continuing to look healthy in 2022.
After identifying them as a unique and ideal fit for the high flexibility market, Altus has installed a number of units to companies across the UK including facilities setting up their first SMT lines, to those with multi-function systems using a mix of pick and place and high speed jetting.
Joe Booth Altus CEO said: “Essemtec and their range of systems are an ideal fit for the UK and Irish market which predominantly focuses on flexibility and speed of changeover rather than cost-per-hour. Given our high percentage of CEMs, Essemtec’s innovative systems align perfectly.
“When initiating the discussions with Essemtec we were especially excited because of their technology and the uniqueness of a multi-function system compared to their competitors. We are the only provider that can jet paste, pick and place components and dispense adhesives and that is very attractive when you consider our cost. In fact, out of the 6 units sold in our first 12 months, four of them had more than one process configured in the system.”
“What a start to our relationship 2021 was and long may it continue!” said Franck Genonceau, Essemtec Sales Director.
“At Essemtec, we have always believed that we have great technology, offering the highest value to our target customers of high-mix low-volume. Due to the structure of manufacturers in the UK and Irish market our products fit perfectly. Now our superior technology has a best-in-class distributor in Altus. They support both customers in pre-sales and partners in after sales so there really are very few reasons not to invest in Essemtec. We have seen that already in our 2021 performance in the region as we hit the ground running with Altus and can only imagine that we will build on that early success through 2022.”
Share on:
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.