-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
GEN3 Provides the Solution for Printed Circuit Board Assembly for Stewart Technology
May 30, 2022 | Gen3Estimated reading time: 1 minute
Gen3 supplies two Nordson Cerno 300.1S Selective Soldering Systems at Stewart Technology’s production facility in Tweedbank, Galashiels, Scotland.
Nordson SELECT supplies selective soldering systems that are supported by a global service network. They are recognised for their innovative products, able to offer a full spectrum of solutions including standalone, in-line and multi-station high-volume soldering systems.
The Nordson SELECT Selective Soldering Systems have been honoured with prestigious awards for innovation and excellence. With over 25 years experience in electronics manufacturing they’re proven both a highly experienced and a devoted team to perform flawlessly tailored products. Nordson SELECT have risen to become the foremost worldwide supplier of Selective Soldering Systems.
The Cerno 300.1S system that was selected by Stewart Technology is a compact in-line selective system featuring combined fluxing, preheating and selective soldering, offering exceptional value and superior process control and is ideally suited for proto-type, small batch production or cell manufacturing requirements.
This system combines fluxing, preheating and selective soldering in a compact footprint ideal for small batch in-line production. This systems is capable of selective soldering printed circuit boards at the same speed as larger or more expensive machines, its is a cost effective solution for customers production lines.
These systems were installed and commissioned in May 2022 and will coincide with the ACE KISS 102L system that was supplied by Gen3 in 2016, this system is still in constant use on their production line and Gen3 are pleased to be able to further enhance Stewart Technology’s production line with another two Selective Soldering Systems.
Shaun Brennand, Technical Director, of Stewart Technology, commented,“We welcome the addition of the 2 new Norsdon Cerno machines. These will contribute to our ongoing growth and focus on improved process technology. We have found over the last 6 years, the demand for Selective Soldering has increased massively due to the increase in circuit complexity and high mix component technology.”
GEN3’s Area Technical Manager, Graham Dickson commented: “Stewart Technology rely heavily on Selective Soldering. As their Production Volume is constantly increasing, it was obvious they needed to invest in new Selective Soldering Systems, so the Nordson Select Cerno 300.1S machine was an ideal solution to meet their requirements. With the Cerno 300.1S having a small foot-print & being highly flexible, Stewart Technology decided to invest in 2 systems”
John Robertson MD & Graham Dickson shaking hands after a successful installation.
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).