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VeCS HDI Process Technology: Has the Time Come for Broader Adoption?

08/25/2026 | Joan Tourné, NextGin Technology
Packaging technology has always driven the PCB, but today's AI and high-performance computing devices are accelerating that relationship. As compute density, bandwidth, and power requirements increase, package, substrate, and PCB design become more interdependent. Modern AI processors, such as NVIDIA's Blackwell architecture, require thousands of package connections, support multiple stacks of high-bandwidth memory (HBM), and can dissipate as much as 1,000 watts of power or more. These demands are driving new approaches to package substrates, redistribution layers (RDLs), thermal management, and PCB fabrication, where manufacturing itself is becoming a limiting factor.

STMicroelectronics, NUS launch Corporate Lab to power the future of Edge AI in Singapore

08/24/2026 | Globe Newswire
HELIX, which stands for Hardware for Embodied Low-power Intelligent Xcceleration, will enable new generative and embodied AI use cases at the edge through system-to-silicon innovation.

CACI Selected to Modernize U.S. Space Force Technology Architecture

08/24/2026 | CACI International Inc.
CACI International Inc announced it has been selected to deliver technology that will defend U.S. interests against adversarial threats for the U.S. Space Force.

Nordson Test & Inspection Opens State-of-the-Art  Center of Excellence

08/21/2026 | Nordson Test & Inspection
Nordson Test & Inspection, a global leader in test, inspection and metrology solutions for semiconductor and SMT markets, has announced the opening of a brand-new, purpose-built Center of Excellence in Phoenix, Arizona.

Qnity Appoints Semiconductor Finance Veteran Ken Rizvi Chief Financial Officer

08/21/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced that it has appointed Ken Rizvi, a seasoned semiconductor finance executive, as Senior Vice President and Chief Financial Officer, effective October 1.
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