Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

HPC Customer Engages Sondrel for High End Chip Design

11/25/2024 | Sondrel
Sondrel, a leading provider of ultra-complex custom chips, has announced that it has started front end, RTL design and verification work on a high-performance computing (HPC) chip project for a major new customer.

Compal, ZutaCore Collaborate to Showcase Groundbreaking Waterless Two-Phase Liquid Cooling Server Solutions at SC24

11/25/2024 | Compal Electronics Inc.
Compal Electronics, a global leader in server innovation, has partnered with ZutaCore®, a leading provider of waterless direct-to-chip two-phase liquid cooling (2P DLC) solutions, to introduce a series of groundbreaking server solutions.

Keysight, Instrumentix Partner to Launch Complete Trade Monitoring Solution for Financial Markets

11/21/2024 | Keysight Technologies
Keysight Technologies, Inc. expanded its financial capital markets portfolio through a partnership with Instrumentix to introduce a cutting-edge trade solution.

Gartner Forecasts MENA IT Spending to Grow 7.4% in 2025

11/20/2024 | Gartner, Inc.
IT spending in the Middle East and North Africa (MENA) region is projected to total $230.7 billion in 2025, an increase of 7.4% from 2024, according to the latest forecast by Gartner, Inc.

ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production

11/20/2024 | ASMPT
The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in