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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Ucamco Introduces UcamX Stencil Seat
May 31, 2022 | UcamcoEstimated reading time: Less than a minute
Ucamco is proud to introduce the UcamX Stencil seat. This seat includes all the standard UcamX functionalities for your everyday operations, supplemented with our brand new Stencil Toolbox.
Stencils, you say? Stencils are used to apply solder paste on ?PCBs in a safe and accurate way. Exact ?amounts of solder paste must be calculated and the stencil must be shaped accordingly.?
Preparing stencils is rocket science. UcamX Stencil seat and the included Stencil Toolbox just became the perfect tools for an amazing lift-off.?
Stencil Toolbox offers a bunch of interesting benefits:
- Streamlined workflow saves you time and money
- Exquisite recognition of pad shapes
- Support for stencil specific shapes
- Independent from incoming data quality
- Instant overview of critical apertures
- Reshaping pads for optimal paste cohesion
- Nano coating support
- Technical drawing for your production
Ucamco currently offers 30-day trials for UcamX Stencil seat for free. Please visit Ucamco’s website for more information.
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Simon Khesin - Schmoll MaschinenSuggested Items
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation
04/14/2026 | Marcy LaRont, I-Connect007The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.
KYZEN Focuses on Aqueous and Stencil Cleaning Solutions at SMTA Monterrey Expo and Tech Forum
04/10/2026 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum.
Solder Paste Innovations for Enhanced Reliability from MacDermid Alpha Electronics Solutions
04/10/2026 | Real Time with... APEX EXPOJason Fullerton of MacDermid Alpha Electronics Solutions discusses innovative alloys like Innolot MXE, low-temperature solder options, and polymer reinforcement strategies. Learn how these solutions address the growing demands of high-performance computing and larger component assemblies, ensuring optimal performance and cost-effectiveness.
Frank Sommer Discusses Selective Soldering Innovations for EVs
04/10/2026 | Real Time with... APEX EXPODan Beaulieu sits down with Frank Sommer, a selective soldering expert from Nordson Electronics Solutions, to discuss the resurgence of selective soldering driven by electric vehicle manufacturing, and the need for robust through-hole component integration. He also introduces Nordson's innovative SELECT Synchro selective soldering machine, designed for enhanced throughput and flexibility.