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Ucamco Introduces UcamX Stencil Seat
May 31, 2022 | UcamcoEstimated reading time: Less than a minute
Ucamco is proud to introduce the UcamX Stencil seat. This seat includes all the standard UcamX functionalities for your everyday operations, supplemented with our brand new Stencil Toolbox.
Stencils, you say? Stencils are used to apply solder paste on ?PCBs in a safe and accurate way. Exact ?amounts of solder paste must be calculated and the stencil must be shaped accordingly.?
Preparing stencils is rocket science. UcamX Stencil seat and the included Stencil Toolbox just became the perfect tools for an amazing lift-off.?
Stencil Toolbox offers a bunch of interesting benefits:
- Streamlined workflow saves you time and money
- Exquisite recognition of pad shapes
- Support for stencil specific shapes
- Independent from incoming data quality
- Instant overview of critical apertures
- Reshaping pads for optimal paste cohesion
- Nano coating support
- Technical drawing for your production
Ucamco currently offers 30-day trials for UcamX Stencil seat for free. Please visit Ucamco’s website for more information.
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Brent Fischthal - Koh YoungSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.