The Power of Consistency: Showing Up Every Day is Half the Battle
The Chemical Connection: Getting the Best from Your Cupric Chloride Etchant
Dan’s Biz Bookshelf: ‘Born to Create’
Indium to Showcase Durafuse Technology at EPP InnovationsFORUM
June 1, 2022 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation will showcase its innovative Durafuse technology at the EPP InnovationsFORUM on Tuesday, June 28 in Leinfelden-Echterdingen, Germany.
The harmful effects of lead on human health and the environment are driving the development of high-temperature lead-free (HTLF) solders to replace high-Pb solders for die-attachment and clip-bond in power device applications. Indium Corporation’s innovative Durafuse HT features a novel design based on a mixed-alloy technology, designed to deliver a tin-rich HTLF paste, presenting the merits of both constituent alloys. Durafuse HT delivers:
- Simplified processing; Durafuse HT is a drop-in replacement for high-Pb solder, with no special equipment needed and minimal process adjustments
- Enhanced thermal cycling reliability; equal or higher than high-Pb solder
- Lower RDS(on) compared to high-Pb solder
Indium Corporation’s award-winning Durafuse LT is a patented low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C. Durafuse LT delivers:
- Improved drop shock performance more than two orders of magnitude better than Bi-containing low-temperature materials
- Drop shock performance equal or better than SAC305 with proper process optimization
- Ideal characteristics for step soldering and low-temperature requirements
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007e book library here.
Share on:
Suggested Items
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
SolderKing Celebrates a Year of Expansion, Innovation, and Sustainability Achievements
12/09/2024 | SolderKing Assembly Materials Ltd,SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, has wrapped up 2024 with a series of milestones that reflect its ongoing growth and commitment to innovation.
ViTrox Expands Midwest Reach with ASC International as New Sales Channel Partner
12/09/2024 | SMTAViTrox Americas Inc. is pleased to announce ASC International as its new Sales Channel Partner and Manufacturers’ Representative for Minnesota, North Dakota and South Dakota.
ASMPT: Innovative Bonding for Power Electronics
12/09/2024 | ASMPTASMPT presents with its SilverSAM™ SilverSAM machine a highlight for makers of modern power electronics: an innovative and versatile silver sintering machine that meets the great demands on bonding, which is particularly critical in the field of electromobility. SilverSAM sets new standards in interconnect technology for power electronics, particularly in the rapidly growing electric vehicle market.
HyRel Announces Sale of First Versacell Robotic System to Leading Defense Contractor
12/03/2024 | HyRelHyRel Technologies, a global provider of quick-turn semiconductor modification solutions, is proud to announce the sale of its first Versacell Robotic Solder Dip & BGA Reballing System to one of the top five defense contractors. Originally developed for internal use, the revolutionary Versacell System drew the attention of the contractor, who recognized its impressive precision, accuracy, and efficiency.