Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
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Atotech to Participate at JPCA Show 2022
June 6, 2022 | AtotechEstimated reading time: Less than a minute
Atotech Japan is excited to welcome you at JPCA Show 2022, Tokyo Big Sight, from June 15 to 17. You can find our team at booth # 6B06, where we will introduce a series of new products and process solutions to the market.
Here is a short list of our show highlights:
Flexible PCBs
- ViaKing® – A new direct metallization process based on graphite
- InPro® FlexFill – A new economical via filling solution for high-end flex PCBs
- V-Plate® – New vertical continuous plating equipment for copper plating
- Stanna-Flex® – New immersion tin finish for high-end flex PCBs
IC-Substrates
- Printoganth® MV TP2 – New electroless Cu process for fine line and high-frequency ICs
- InPro® SAP5 – New BMV filling in VCL systems for ICs at high current density
- InPro® CPF2 – A new electrolytic process for copper pillar plating on C4 side
- NovaBond® EX-S2 – A new ultra-low roughness bonding enhancement for IC substrates
- Uniplate® NGU – High-end PCB equipment for mSAP and amSAP applications
Event: JPCA Show 2022
Date: June 15-17, 2022
Venue: Tokyo Big Sight East Exhibition Halls
Booth: #6B-06
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