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Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
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Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
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ASC International Launches High-speed, Sophisticated Inline 3D SPI
June 6, 2022 | ASC InternationalEstimated reading time: 1 minute
ASC International, a leading manufacturer of 3D solder paste inspection (SPI) and automated optical inspection (AOI) systems, is pleased to announce that the LineMaster Fusion 3D takes inline SPI to a new level with its unmatched price to performance value proposition. The Fusion 3D provides all of the required features for high-speed inline 3D solder paste inspection at an amazingly affordable price.
The LineMaster Fusion 3D provides sophisticated 3D solder paste measurement coupled with an intuitive user interface and Windows 10 OS. With only a few minutes of training, an operator can perform accurate and reliable 3D measurements of solder paste deposits as well as many other important SMT measurement applications. LineMaster's completely automatic solder paste measurement process eliminates manual board handling as found with offline SPI systems and provides operators with immediate feedback to reduce printer related defects.
With industry-leading 4um X-Y pixel resolution and .17um Z height resolution sensor technology, the Fusion 3D provides exceptional value for the electronics manufacturer concerned with improving production yields hindered by poor overall quality of their print process. The SPI system features five-minute Gerber/CAD import programming with fully integrated SPC analytics, real-time data review and qualitative analysis of solder paste deposition utilizing realistic 3D rendering for accurate print quality detection.
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