Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
Arch Systems Names Benjamin Freeman VP of Engineering
June 6, 2022 | Arch SystemsEstimated reading time: 1 minute
Arch Systems, the leading provider of machine data and analytics for electronics assembly operations, announced the appointment of Benjamin Freeman to Vice President of Engineering. The company is in an active hiring phase as a result of significant growth.
An experienced, driven R&D leader, Freeman has a track record for growing great concepts into great businesses. He specializes in analytics and technology-assisted optimization of physical processes. Freeman’s background includes driving collaboration across business functions, from finance, sales and customer success, to software development and R&D, to industrial engineering and operations.
“Arch is well on its way to becoming the leading manufacturing data analytics platform provider and I’m thrilled to be joining this award-winning team,” said Freeman. Tim Burke, Arch CTO and co-founder, shared those sentiments, “Ben is a great fit for Arch and his presence further positions Arch as a market leader. We are very excited to have him leading our engineering teams as we experience unprecedented demand and growth.”
Freeman has specialized in software engineering for 23 years. He started out at Oracle, Inc. in 1999. Since, he has held numerous upper-level software engineering roles at respected companies, including his most recent position as Executive Director of Engineering and Planning at Ingram Micro/Shipwire. Here, he was responsible for the development and planning lifecycle of eCommerce Fulfillment. He also helped the company’s US-based development team establish an international footprint.
Arch is a recipient of the 2021 Global Technology and Mexico Technology Awards, and a 2022 NPI Award. The ArchFX Platform provides the machine connectivity, data management, and advanced insights needed to achieve digital transformation across the manufacturing organization
Share on:
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).