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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Bowman's Micro XRF Measures Smallest Features in Wafers, Microelectronics
June 6, 2022 | BowmanEstimated reading time: 1 minute
Bowman has introduced an important addition to its suite of precision XRF instruments used in the PCB, semiconductor and microelectronics industries.
The Bowman A Series Micro XRF quickly measures the smallest features on semiconductors and microelectronics. It accommodates very large PCB panels, and wafers of any size, for full sample coverage and multi-point programmable automation.
Poly-capillary optics focus the X-ray beam to 7.5 µm FWHM, the world’s smallest for XRF coating thickness analysis. A 140X magnification camera measures features on that scale; a secondary, low magnification camera provides live-viewing of samples and “birds-eye” macro-view imaging. Bowman’s proprietary dual-camera system lets operators see the entire part, click the image to zoom with the high-mag camera, and quickly identify the feature of interest.
A programmable X-Y stage with movement of 23.6 in (600 mm) in each direction can handle the largest samples in the industry. The stage has precision down to +/- 1 µm for each axis, and is used to select and measure multiple points; Bowman pattern recognition software and auto-focus features also do this automatically. The system’s 3D mapping capability can be used to view the topography of ENIG, ENEPIG, EPIG and other elite processes.
A Series instruments include 7.5 µm optics with molybdenum anode tube (chromium and tungsten also available) and a high-resolution, large-window Silicon Drift Detector (SDD) which processes more than 2 million counts per second. SDDs are the standard, industry-wide, for complex thin films. The high count rate capability is key to achieving a low minimum detection limit (MDL) and highest spectral resolution.
A Series systems are distinctive in that they are cleanroom-ready, have the largest semiconductor stage movement on the market, and are supported worldwide by a service network that provides same-day response for every benchtop XRF requirement. Equipment evaluation, selection, commissioning, maintenance and modernization is available for users of Bowman instruments, as well as other major XRF brands.
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