Candor Nails the ROI With InduBond
June 7, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
Nolan Johnson follows up on his original interview with Sunny Patel, engineering manager at Candor Industries, about the economics of this new InduBond X-Press 360 lamination press. It sounds like Sunny has hit the “easy” button with the installation of this machine.
Nolan Johnson: You recently installed the InduBond X-Press 360 lamination press. There’s a lot of hype and promise around this particular technology regarding energy savings and versatility. What are your impressions in using this press?
Sunny Patel: Well, the hype is real. It’s such a great machine. Because of its simplicity and the flexibility of use, I find it a lot easier to work with than our previous press. The energy savings speak for themselves; the capabilities of going up to 375°C and 65 kg/cm2 pressure allows us to do pretty much any kind of pressing. The name of the game right now is to try to increase your available capabilities; the press does that without many difficulties. You don’t need a PhD on the machine and it’s very easy to use. We’re very happy with it.
Johnson: That’s great to hear. Capabilities and energy use are two of the things that are significantly better. Is there a positive impact on throughput?
Patel: Yes. The system that we used before was a good system. But the nice thing about the InduBond is you can control both the heating and the cooling. Because everything is so dialed in, the time we used to take to wait for the cooling has dramatically decreased. There’s a lot of throughput increase as well, not only on that side, but also the layout process, because previously we had used a continuous copper foil lamination system. Other people may not have the same problem; they would have problems with pinning. Our headache may not have been pinning, but other board shops may find this a lot easier because it’s a pinless system.
You don’t have to move around bulky press plates. Just build your book, put in your stainless steel, and just keep stacking; it’s simple to do. I can do it and I never ran a press before this one. Overall, throughput has increased, just because of the capability. The smaller your press stack is, the faster you can heat up because there’s less load. You can even do the small quick-turns pretty fast.
Johnson: Have you had a chance to put together some numbers on how the operating costs have changed? For example, you said that the energy savings are dramatic. What are the numbers?
Patel: I don’t have the numbers in front of me, but I believe I calculated one press before to be $40 or $50 a lamination press cycle. Now it’s around $5. If you add up all the presses, it’s quite a significant savings. Not only that, but we’re using less copper. And because the layout is easier, we’re saving on time.
To read this entire conversation, which appeared in the May 2022 issue of PCB007 Magazine, click here.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.
Volatile Metals Market Creates PCB Pricing Headache
04/20/2026 | Nolan Johnson, I-Connect007Market volatility for precious metals is very real. Financial organizations have reported elevated volatility, with record highs and steep corrections; in 2025 alone, gold has increased by over 60%, silver over 120%, and copper over 35%. Each is a critical raw material used in electronics manufacturing, where pricing is already fraught for business owners and their customers due to tariff uncertainty and a critical supply chain that resides mostly in China. The volatility of precious metals markets adds yet another layer of complexity for manufacturers, pushing up raw material costs.