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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Matrix USA Promotes Sunil Shah to VP, New Product Development
June 8, 2022 | Matrix USA Inc.Estimated reading time: Less than a minute
“Matrix is pleased to announce that Sunil has been promoted to VP, New Product Development. Sunil has been with our Company for over 20 years, and during that time he has always exceeded expectations. With his extensive knowledge of Printed Circuit manufacturing, he will surely assist our customers by bringing the Products and Technologies of our Principals directly into North American PCB shops,” says Kieran Healy, President of Matrix Circuit Board Materials.
Sunil has been the major contributor to the Company’s growth in the High Tg FR-4 market, focusing on the Kingboard Product Group for the past 10 years.Going forward, he will now expand his focus and energy to include the Soldermask and Dryfilm segments. Over the next few months, you can expect to hear from Sunil, and some of these new technologies. Please give him a warm welcome as he makes the rounds.
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07/09/2025 | Bell Textron Inc.Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 2 of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program with the objective to complete design, construction, ground testing and certification of an X-plane demonstrator.
Nolan’s Notes: Moving Forward With Confidence
06/03/2025 | Nolan Johnson -- Column: Nolan's NotesWe’re currently enjoying a revitalized and dynamic EMS provider market with significant growth potential. Since December 2024, the book-to-bill has been extremely strong and growing. Starting with a ratio of 1.24 in December, book-to-bill has continued to accelerate to a 1.41 in April. Yet, there is a global economic restructuring taking place. To say that the back-and-forth with tariffs and trade deals makes for an uncertain market is an understatement. While we may be in a 90-day tariff pause among leading economic nations, the deadline is quickly approaching and that leaves many of you feeling unsettled about what to expect.
Mycronic High Flex Changes Division Name to PCB Assembly Solutions
05/20/2025 | MycronicMycronic AB, the leading Sweden-based electronics assembly solutions provider, announced that its division formerly known as High Flex will now operate under the name PCB Assembly Solutions.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Foxconn's Tiger Leap Combining Nature and Technology in Ecological Roof Garden
04/23/2025 | FoxconnHon Hai Technology Group, the world's largest technology manufacturing and service provider, has actively responded to the United Nations Sustainable Development Goals (SDGs).