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Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology

06/17/2025 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case,

Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing

06/11/2025 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd

Japan’s Sharp to Sell LCD Plant to Taiwanese Parent Company Foxconn

05/14/2025 | I-Connect007
Japanese electronics firm Sharp Corp. announced on May 12 that it plans to sell its Kameyama No. 2 liquid crystal display plant to its Taiwanese parent company, Foxconn.

Panel Driver IC Price Decline Slows in 1H25; Gold Prices, China Subsidies, and U.S.-China Tariffs Emerge as Key Variables

04/28/2025 | TrendForce
TrendForce’s latest investigation finds that China’s subsidy policies and rising concerns over reciprocal tariffs are reshaping brand strategies in the panel market, indirectly influencing price trends for panel driver ICs.

Tandem Panel Shipments to Jump Again to 36% in 2026

04/25/2025 | BUSINESS WIRE
According to recent display industry research from Omdia, tandem RGB penetration into the OLED tablet and notebook panel markets surged from almost zero to more than 30% in 2024.
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