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Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
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I-Connect007 Editor’s Picks: Five Must-Reads for the Week
June 10, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
PCB fabrication is back in the news this week and posting high readership numbers as well. Among the most-read news, we see industry leaders changing roles, capital equipment shipment milestones, operational cost efficiencies, and, last but not least, cybersecurity.
Mike Carano Joins the Averatek Team as Vice President of Quality
Published June 3
As a former VI at RBP Chemical Technology, and Global R&D director at OM Group, as well as an influential advisor for IPC, I-Connect007 columnist Mike Carano brings a deep skillset to this new role with Averatek. Read the details here.
The Double-edged Sword of CMMC 2.0
Published June 6
MX2 Technology’s Divyash Patel updates readers on CMMC (Cybersecurity Maturity Model Certification) overall, and the upcoming version 2.0 criteria specifically. Given the likelihood that CMMC will touch most of us in the industry eventually, readers clearly wanted to know more.
Atotech Sells 1,000th Horizontal Electrolytic Copper Plater
Published June 8
Atotech announced the sale of its 1,000th installation of the Uniplate horizontal plating line to a Taiwan-based PCB manufacturer. The article also includes a timeline of milestones in the Uniplate line.
Isola Lays Groundwork for Faster, Higher-Frequency Circuits at 2022 IMS
Published June 7
If you’re visiting the 2022 IEEE International Microwave Symposium in Denver, Colorado, June 21-23, Isola will be present, discussing hybrid design and fabrication and dielectric constants in materials. Readership was high for this article; find the details inside.
Candor Nails the ROI With InduBond
Published June 7
Sunny Patel is engineering manager at Candor Industries. We follow up on Sunny Patel’s initial interview about the economics of this new InduBond X-Press 360 lamination press. It sounds like Sunny has hit the “easy” button with the installation of this machine.
Suggested Items
DuPont Showcases AI Innovations Featuring Advanced Interconnects at 2024 International Electronic Circuits Exhibition
05/13/2024 | DuPontDuPont announced it will showcase its comprehensive range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Exhibition in Shanghai. With a product portfolio that includes fine line, signal integrity, power and thermal management, DuPont will exhibit at Booth #8L06 at the National Exhibition and Convention Center (NECC) from May 13 to 15.
MKS’ Atotech to Participate in ECTC
05/10/2024 | MKS’ AtotechAt this year’s 74th IEEE Electronic Components and Technology Conference (ECTC), MKS’ Atotech will present and demonstrate its latest product and service innovations.
The Chemical Connection: Reducing Etch System Water Usage, Part 2
05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.