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In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
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Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
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This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
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iNEMI Webinar on Low Temperature Material for 1st Level Interconnect
June 13, 2022 | iNEMIEstimated reading time: 1 minute
The objective of iNEMI’s Low Temperature Materials for 1st Level Interconnect project is to determine the extent to which the use of lower temperature processes can provide solutions to the challenges of the accelerating trend toward heterogenous integration. Most of the elements of these packages have limits on temperature/time exposure, which makes materials that can effect reliable connections at temperatures lower than those required by conventional materials worth consideration.
A task force has reviewed material and process options currently available or under development on the basis of their compatibility with the interfaces that have to be connected and the operating conditions to which they are likely to be exposed in integrated circuit packages. Join us for this webinar in which the results of our findings about the prospects for the adoption of low temperature materials for 1st level interconnect will be presented and discussed.
Registration
This webinar is open to industry; advance registration is required. Two webinars (with the same content) are scheduled — please join whichever session fits your schedule, please visit iNEMI's website.
Session 1 (APAC)
Tuesday, June 28, 2022
10:00-11:00 a.m. JST (Japan)
9:00-10:00 p.m. EDT (Americas) on Monday, June 27
Session 2 (Americas & EMEA)
Tuesday, June 28, 2022
9:00-10:00 a.m. EDT (Americas)
3:00-4:00 p.m. CEST (Europe)
10:00-11:00 p.m. JST (Japan)
Suggested Items
Material Insight: The Dielectric Constant of PCB Materials
05/17/2024 | Dr. Preeya Kuray -- Column: Material InsightIn the world of PCB design, miniaturization can be achieved by using low dielectric constant (Dk) materials. Low Dk materials can allow for a reduction in thickness while maintaining a given trace width, leading to lower transmission loss and higher density circuitry.
IPC APEX EXPO: Some Thoughts About Growth
05/16/2024 | Dan Feinberg, I-Connect007After two and a half days of wandering the aisles at IPC APEX EXPO 2024, for the first time, I almost felt like I was exploring CES. There were so many booths and exhibits that I could describe, but I’d like to focus on the growth and huge value of this event, which has expanded well beyond just the growing and impressive exhibit show floor.
The Shaughnessy Report: Unlock Your High-speed Material Constraints
05/15/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportThe world of PCB materials used to be a fairly simple one. It was divided into two groups: the “traditional” laminates, often called FR-4, and the high-speed laminates developed especially for high-speed PCBs. These were two worlds that usually didn’t collide. But then traditional laminates started getting better, and high-speed designers and design engineers took notice and started to reconsider what FR-4 could be used for.
Breaking High-speed Material Constraints: Design007 Magazine — May 2024
05/14/2024 | I-Connect007 Editorial TeamDo you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems instead of high-speed materials, saving time and money while streamlining the fab process. In the May 2024 issue of Design007 Magazine, our contributors explain how to avoid overconstraining your materials when working with high-speed boards.
Indium Experts to Present at Electronics in Harsh Environments SMTA Conference
05/13/2024 | Indium Corporationndium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will deliver both a workshop and technical presentation at the Electronics in Harsh Environments SMTA Conference on May 14-16 in Copenhagen, Denmark.