Marcy’s Musings: Advancing the Advanced Materials Discussion
The Marketing Minute: Cracking the Code of Technical Marketing
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
iNEMI Webinar on Low Temperature Material for 1st Level Interconnect
June 13, 2022 | iNEMIEstimated reading time: 1 minute
The objective of iNEMI’s Low Temperature Materials for 1st Level Interconnect project is to determine the extent to which the use of lower temperature processes can provide solutions to the challenges of the accelerating trend toward heterogenous integration. Most of the elements of these packages have limits on temperature/time exposure, which makes materials that can effect reliable connections at temperatures lower than those required by conventional materials worth consideration.
A task force has reviewed material and process options currently available or under development on the basis of their compatibility with the interfaces that have to be connected and the operating conditions to which they are likely to be exposed in integrated circuit packages. Join us for this webinar in which the results of our findings about the prospects for the adoption of low temperature materials for 1st level interconnect will be presented and discussed.
Registration
This webinar is open to industry; advance registration is required. Two webinars (with the same content) are scheduled — please join whichever session fits your schedule, please visit iNEMI's website.
Session 1 (APAC)
Tuesday, June 28, 2022
10:00-11:00 a.m. JST (Japan)
9:00-10:00 p.m. EDT (Americas) on Monday, June 27
Session 2 (Americas & EMEA)
Tuesday, June 28, 2022
9:00-10:00 a.m. EDT (Americas)
3:00-4:00 p.m. CEST (Europe)
10:00-11:00 p.m. JST (Japan)
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
Marcy’s Musings: Advancing the Advanced Materials Discussion
09/17/2025 | Marcy LaRont -- Column: Marcy's MusingsAs the industry’s most trusted global source of original content about the electronics supply chain, we continually ask you about your concerns, what you care about, and what you most want to learn about. Your responses are insightful and valuable. Thank you for caring enough to provide useful feedback and engage in dialogue.
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.