Rogers Corporation to Present & Exhibit at 2022 IMS in Denver, Colorado
June 14, 2022 | Rogers CorporationEstimated reading time: 2 minutes
Rogers Corporation has announced that Technical Marketing Manager John Coonrod will give three presentations on June 21 in the MicroApps Theater at the International Microwave Symposium (IMS) in Denver. His topics will include “Radix 3D Printable Dielectrics & Lens Demonstrator,” “An Overview of Copper Foil: How It's Made, Roughness Effects & RF/ HSD Influences,” and “How to Get Consistent Millimeter-Wave Performance Using Grounded Coplanar Waveguide.”
In addition, Rogers will be showcasing its most recently released products in Booth #2030 during IMS, the world’s largest RF and Microwave show, which takes place from Tuesday, June 21 to Thursday, June 23. These products include Radix™ 3D Printable Dielectrics and RO4835IND™ LoPro® Laminates.
Radix™ 3D Printable Dielectric, is the first 3D material featuring a dielectric constant of 2.8 and low loss characteristics at microwave frequencies. These printable dielectric materials give radio frequency (RF) designers unprecedented design freedom in creating new components, eliminating the need to consider typical manufacturing design constraints.
Rogers Corporation’s Radix3D Printable Dielectric is a proprietary composite material designed for Digital Light Processing (DLP) 3D printing, enabling a scalable, high-resolution printing process for end-use RF dielectric component manufacturing. This printable dielectric material has a targeted dielectric constant of 2.8 and a dissipation factor of 0.0043 at 10 GHz when cured.
The new material is intended for use as RF material in applications where new geometric freedom can enhance the figure of merits of an RF system, such as gradient dielectric constant (GRIN) structures and other complex three-dimensional parts. The Radix 3D Printable Dielectric offers the industry a way to manufacture systems and components at scale that could not be made with traditional fabrication methods. Radix materials are available directly from Rogers Corporation and our 3D printing partners.
RO4835IND LoPro thermoset laminates are specially designed for 60-81 GHz short-range industrial radar applications, where excellent electrical performance and cost-efficiency are equally important. These laminates also provide environmental reliability and interconnection stability, which are critical criteria for PCB material selection.
With a low insertion loss of 2.13dB/inch at 60 GHz, these laminates meet customers’ critical radar coverage requirements. The expanded weave fiber provides excellent Dk uniformity, and Rogers’ tight quality control provides low Dk variation from lot to lot. RO4835IND LoPro laminates are compatible with standard epoxy/glass (FR-4) processes and have a higher fabrication yield rate compared to conventional PTFE-based laminates. Low material and fabrication costs make RO4835IND LoPro laminates a cost-effective solution for industrial radar.
To learn more about Radix 3D Printable Dielectrics, visit Rogers' youtube channel, https://www.youtube.com/c/RogersCorpACS
About Rogers Corporation
Rogers Corporation (NYSE:ROG) is a global leader in engineered materials to power, protect and connect our world. Rogers delivers innovative solutions to help our customers solve their toughest material challenges. Rogers’ advanced electronic and elastomeric materials are used in applications for EV/HEV, automotive safety and radar systems, mobile devices, renewable energy, wireless infrastructure, energy-efficient motor drives, industrial equipment and more. Headquartered in Chandler, Arizona, Rogers operates manufacturing facilities in the United States, Asia and Europe, with sales offices worldwide.
Suggested Items
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
01/07/2025 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... High Performance Materials, Chapter 4
01/02/2025 | I-Connect007In Chapter 4, Michael Gay discusses the two main types of copper foil used for PCB boards today: electrodeposited (ED) foil and rolled annealed (RA) foil. He also explains the pros and cons of each, and provides an update of the latest innovations in copper foil technology.
Connect the Dots: Designing for Reality—Solder Mask and Legend
01/02/2025 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we discussed the strip, etch, and strip process. At this point, we have a functioning board, but we still need to protect the PCB from environmental effects and document the circuit components. This brings us to the solder mask and legend phase of production.
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.