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ITW Sees Drastically Increased Nitrogen Purity with South-Tek Systems Nitrogen Generator
June 17, 2022 | South-Tek SystemsEstimated reading time: Less than a minute
South-Tek Systems is pleased to announce that it participated in the recent Kurt Whitlock Associates (KWA) Open House at KWA’s Demonstration Lab in St. Cloud, Florida. South-Tek Systems’ N2GEN TS Nitrogen Generator was paired with the ITW EAE Vitronics Soltec Zeva M selective solder machine. ITW ran circuit boards using the South-Tek N2GEN PSA nitrogen generator and realized nitrogen purities up to 99.999 percent.
The N2GEN series of PSA nitrogen generators are custom designed and can be packaged with a dedicated air compressor, dryer and/or booster if needed for a complete turnkey solution. For larger flow rates or redundancy, duplexing options are available.
Since 1978, Kurt Whitlock Associates has searched the world for cutting-edge companies to represent and distribute to its valued electronics assembly customers and potential markets. Since 1998 KWAs Demonstration Lab has developed process solutions and equipment selections that have and can be duplicated throughout customers production facilities.
Kurt Whitlock Associates understands the tiers of assembly requirements of its customers. The company represents an array of companies that provide unmatched solutions to meet high volume, high mix, and mid to low volume requirements with the same level of service and technical support.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.