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Seika Machinery Presents New Flagship Viscometer from Malcom
June 21, 2022 | Seika Machinery, Inc.Estimated reading time: Less than a minute

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to introduce Malcom’s new flagship CE certified viscometer as the industry standard for testing solder paste viscosity. The new Malcom PCU-285 Viscometer features an onboard PC with a full LCD touchscreen display. The heating also has been improved for faster and more stable temperature control.
Viscosity is an important parameter for solder paste, as a paste that is too thick (high viscosity) may lead to a bad print in the form of an insufficient filet. A paste that is too thin (low viscosity) may lead to the filet slumping. In order to test that a paste has the proper thickness for optimal printing, the paste’s viscosity should be checked with an accurate and repeatable viscosity meter.
Malcom’s unique Spiral Sensor provides continuous measurement of non-newtonian fluids with excellent repeatability. Malcom utilizes a patented double cylinder pump method to ensure proper and successful screen printing.
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Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.