Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Thermaltronics Embraces Strict Quality Control for Superior Solder Robots
June 21, 2022 | Thermaltronics USA, Inc.Estimated reading time: 1 minute
Thermaltronics USA, Inc. is pleased to announce that its solder robots go through extensive quality control procedures in order to maintain the company’s position as the most awarded, accurate and versatile solder robot on the market.
Thermaltronics embraces both strict quality control and conformance with International Manufacturing Standards, is in compliance with ISO 9000 & ISO 14000 and holds certification in TuV, GS, NRTL & CE.
Thermaltronics manufactures and supplies a wide range of soldering products and accessories used in the electronics manufacturing industry. Design and development is undertaken in the USA and Australia, with final production taking place in a customized manufacturing facility, incorporating specialized equipment and in accordance with recognized international standards of quality and compliance.
The Thermaltronics Robot System incorporates innovative design concepts and precision components to ensure accuracy. The combination of high precision hardware and intelligent software ensures precision soldering and low operator training costs.
Unlike typical Cartesian robots the Thermaltronics Robot, Model TMT-R9900S, is equipped with full vision to verify the procedure being undertaken and does not simply follow a pre-determined program. In this respect it has an observation mode, a verification mode and as a result – a decision making capability. This capability of collecting and utilizing data for production processing is one of the most important factors necessary to meet the requirements of Industry 4.0 standards.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.