The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
GEN3’s Dr. Chris Hunt Submits Insightful Paper to Journal of Surface Mount Technology
June 28, 2022 | Gen3Estimated reading time: 1 minute
GEN3 a British manufacturer of testing and measuring the electronics industry announced that Dr. Chris Hunt, CTO, has written a paper for SMTA on a gage study of an intercomparison evaluation to implement the use of fine-pitch test patterns for surface insulation resistance (sir) testing of solder fluxes.
SIR is a recognized tool for establishing the electrochemical reliability of electronic assemblies. Currently, the test patterns in the standards reflect coarse pitch components. An intercomparison has been completed with the aim of establishing the introduction of a fine pitch SIR pattern with a 200µm gap. This exercise included the contribution of seven international participants. This new pattern moves the test method forward into the realm of current technologies where components of this pitch are commonplace. The study reported here validates the basis for the introduction of the new pattern and confirms acceptable Gauge R&R for the SIR technique. The analysis also highlights the challenges in controlling humidity to achieve comparable results between different users. The results also point to the challenges in achieving acceptable Gauge R&R when measuring resistances >1011?.
Gen3 alongside Dr. Chris Hunt is active in the development of many IPC standards and has won many awards for this work. Much of this standard work has been in the area of surface insulation resistance measurements and conductive anodic filamentation, of which this paper evidences.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.