Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
PulseForge's Stan Farnsworth to Present Sustainable Manufacturing Practices at the FLEX Conference
June 30, 2022 | PulseForgeEstimated reading time: 1 minute
PulseForge, Inc., a new spinoff of NovaCentrix, is pleased to announce that Stan Farnsworth, Chief Marketing Officer, will present during the FLEX Conference, co-located with SEMICON West the Moscone Center in San Francisco, California. The presentation entitled, “Soldering on Lightweight Plastic: Sustainable Manufacturing of Innovative Product Concepts,” will take place Wednesday, July 13, 2022.
Electronics manufacturing is not exempt from the societal drive to improve overall sustainability, including materials and energy utilization. Multi-zone solder reflow ovens are a major energy use due to prolonged operation at elevated temperatures necessary for reflowing industry-standard SAC305 solder, both functionally for effecting the solder melt, as well as operationally to avoid their multi-hour warm-up and equilibration times. This same thermal process used for reflowing solder is also a barrier to broader utilization of flexible hybrid electronics.
Market demand for lightweight, conformal electronics has surpassed current traditional equilibrium-based thermal processes such as reflow soldering. Low-temperature, lightweight substrate materials such as PET, and electronic components such as cameras, sensors and bioprocessors can typically not withstand sustained exposure to soldering temperatures.
Farnsworth will offer next-generation thermal processing, which decarbonizes the supply chain by utilizing as little as 15 percent of the energy of standard processing. Sustainable manufacturing practices often come at the sacrifice of performance and/or cost, with what can be referred to as a Green Premium. Through also providing improved performance and throughput, this new soldering technology dispels the notion of a Green Premium. The new soldering capability enables next-generation applications in applications such as medical and lifestyle wearables, consumer electronics such as AR/VR goggles, and opens the door to broader innovation while still meeting ideals and practice of sustainable manufacturing.
Farnsworth has been bringing deep-tech innovation to markets and applications for more than 20 years. He is the Chief Marketing Officer for the newly-created PulseForge Inc, recently spun out of NovaCentrix where he was also Chief Marketing Officer as well as a founding member. Prior, he was a founding member of Nanotechnologies Inc (1999), an early pioneer and recognized leader in the nanomaterial space. Farnsworth earned his BS in mechanical engineering from Rice University and MS in mechanical engineering from the University of Texas, Austin, specializing in heat transfer and fluid mechanics.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.