-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
PulseForge's Stan Farnsworth to Present Sustainable Manufacturing Practices at the FLEX Conference
June 30, 2022 | PulseForgeEstimated reading time: 1 minute

PulseForge, Inc., a new spinoff of NovaCentrix, is pleased to announce that Stan Farnsworth, Chief Marketing Officer, will present during the FLEX Conference, co-located with SEMICON West the Moscone Center in San Francisco, California. The presentation entitled, “Soldering on Lightweight Plastic: Sustainable Manufacturing of Innovative Product Concepts,” will take place Wednesday, July 13, 2022.
Electronics manufacturing is not exempt from the societal drive to improve overall sustainability, including materials and energy utilization. Multi-zone solder reflow ovens are a major energy use due to prolonged operation at elevated temperatures necessary for reflowing industry-standard SAC305 solder, both functionally for effecting the solder melt, as well as operationally to avoid their multi-hour warm-up and equilibration times. This same thermal process used for reflowing solder is also a barrier to broader utilization of flexible hybrid electronics.
Market demand for lightweight, conformal electronics has surpassed current traditional equilibrium-based thermal processes such as reflow soldering. Low-temperature, lightweight substrate materials such as PET, and electronic components such as cameras, sensors and bioprocessors can typically not withstand sustained exposure to soldering temperatures.
Farnsworth will offer next-generation thermal processing, which decarbonizes the supply chain by utilizing as little as 15 percent of the energy of standard processing. Sustainable manufacturing practices often come at the sacrifice of performance and/or cost, with what can be referred to as a Green Premium. Through also providing improved performance and throughput, this new soldering technology dispels the notion of a Green Premium. The new soldering capability enables next-generation applications in applications such as medical and lifestyle wearables, consumer electronics such as AR/VR goggles, and opens the door to broader innovation while still meeting ideals and practice of sustainable manufacturing.
Farnsworth has been bringing deep-tech innovation to markets and applications for more than 20 years. He is the Chief Marketing Officer for the newly-created PulseForge Inc, recently spun out of NovaCentrix where he was also Chief Marketing Officer as well as a founding member. Prior, he was a founding member of Nanotechnologies Inc (1999), an early pioneer and recognized leader in the nanomaterial space. Farnsworth earned his BS in mechanical engineering from Rice University and MS in mechanical engineering from the University of Texas, Austin, specializing in heat transfer and fluid mechanics.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.