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High Density Packaging User Group Announces Grace Electron Membership
June 30, 2022 | HDP User GroupEstimated reading time: Less than a minute
High Density Packaging (HDP) User Group is pleased to announce that Grace Electron Technology Co., LTD. has become a member.
“Grace Electron is a leading manufacturer of advanced halogen-free laminates suitable for high-frequency, high-speed applications,” said Dr. Winston Wong, CEO at Grace T.H.W. Group. “These laminates are used for telecommunications products that require low transmission losses and a low degree of distortion, such as wireless base stations, storage, and advanced cloud computing servers. We look forward to collaborating with HDP member companies on evaluating advanced materials for high frequency, high-speed applications.”
“I am pleased to welcome Grace Electron to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in ultra-low loss materials will contribute significantly to several of our projects, especially those focused on next-generation high-frequency applications”, said Larry Marcanti, Executive Director of HDP User Group.
Suggested Items
Untapped Potential: Automating Warehouse Management Into the Present
10/15/2024 | Josh Casper, Horizon SalesThe push toward automation in electronics manufacturing has led to significant improvements in SMT and through-hole technology (THT) production. Today’s manufacturers are outfitted with precision pick-and-place machines, sophisticated inspection systems, and advanced solder deposition solutions. These investments reflect a broader industry trend toward automating high-value production tasks to boost efficiency, improve quality, and reduce headcount in a shrinking labor market. While the spotlight has rightly focused on automating SMT production, one crucial area remains woefully under-invested: materials storage and handling.
Ventec Promotes Bill Wang to Group Technical Vice President
10/14/2024 | VentecVentec International Group, a Taiwan Stock Exchange listed global supplier of advanced base materials for the PCB industry worldwide, has promoted Bill Wang to Group Technical Vice President.
Molg Raises $5.5M in Seed Funding to Tackle Electronics Waste Through Circular Manufacturing
10/11/2024 | PRNewswireMolg Inc. announces the closing of $5.5 million in seed funding to scale the company's circular manufacturing processes for electronics and electrical components. Closed Loop Partners' Ventures Group led the round, with participation from Amazon Climate Pledge Fund,
It’s a Wrap for PCB West 2024
10/11/2024 | Marcy LaRont, PCB007 MagazinePCB West 2024 wraps up Friday, Oct. 11 at the Santa Clara Convention Center (SCCC) in sunny Santa Clara, California. The SCCC is situated next to the “new” Levi’s Stadium, home to the San Francisco 49ers, and directly adjacent to California’s Great America amusement park—both noteworthy landmarks for natives like me. The technical conference, Oct. 8-11, featured 50 technical presentations by 39 different speakers.
Ventec Consolidates and Upgrades European Production and Logistics Center in Germany
10/10/2024 | VentecVentec International Group has begun consolidating operations and installing new, state-of-the-art facilities at its European production and logistics hub in Kirchheimbolanden, Germany.