- pcb007 Magazine
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
In this issue, the biggest names in PCB manufacturing share their economic outlook for the upcoming year and beyond. As you will see, they were all bullish on our industry, but there was some apprehension as well. No one wants to get burned by another the supply chain disruption.
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- pcb007 Magazine
High Density Packaging User Group Announces Grace Electron MembershipJune 30, 2022 | HDP User Group
Estimated reading time: Less than a minute
High Density Packaging (HDP) User Group is pleased to announce that Grace Electron Technology Co., LTD. has become a member.
“Grace Electron is a leading manufacturer of advanced halogen-free laminates suitable for high-frequency, high-speed applications,” said Dr. Winston Wong, CEO at Grace T.H.W. Group. “These laminates are used for telecommunications products that require low transmission losses and a low degree of distortion, such as wireless base stations, storage, and advanced cloud computing servers. We look forward to collaborating with HDP member companies on evaluating advanced materials for high frequency, high-speed applications.”
“I am pleased to welcome Grace Electron to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in ultra-low loss materials will contribute significantly to several of our projects, especially those focused on next-generation high-frequency applications”, said Larry Marcanti, Executive Director of HDP User Group.
Indium Corporation advisor, and founder/principal of DS&A LLC, Dave Saums will present on innovative thermal materials for semiconductor testing at TestConX 2024, held in Mesa, AZ, March 3-6.
Key Supplier for Mechanical and Optical Processes in the New Teltonika PCB Factory – Schmoll Maschinen GmbH02/14/2024 | Schmoll Maschinen
Schmoll Maschinen is very happy to become the business partner of Teltonika and to become part of one of the biggest projects in the PCB industry in Europe for the last 5 years.
Kerafol and X2F are teaming up to develop state-of-the-art thermal management solutions for electronic devices by leveraging the advantages of Kerafol's thermally conductive materials and X2F's patented controlled-viscosity molding technologies.
Heraeus Electronics, a leading provider of advanced materials solutions, is pleased to announce the successful acquisition of the PriElex electronics inks business line from Kayaku Advanced Materials Inc.
The designer needs to have a working understanding of two key manufacturing operations: basic circuit board fabrication procedures and assembly process practices. For printed circuit board manufacturing, the number of steps required to produce the printed circuit board correlates to the circuit board's complexity. Greater process complexity in fabricating the circuit board equates to increased costs. To develop any portion of the electronic product, the designer must apply the design for manufacturing (DFM) principles established in the industry. In fact, DFM should always be the goal of the design engineer. It encompasses a wide range of disciplines that must be considered during the planning phase of any product.