-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Rogers to Feature Advanced Materials Technology, Capabilities for Antennas at IEEE AP-S
July 5, 2022 | Rogers CorporationEstimated reading time: 1 minute

Rogers Corporation will exhibit at the IEEE International Symposium on Antennas & Propagation (IEEE AP-S) in Denver, CO (Booth #400) on July 12-14.
The IEEE AP-S conference is intended to provide an international forum for the exchange of information on state-of-the-art research in antennas, propagation, electromagnetic engineering and radio science.
Key Rogers’ products being featured include:
Recently introduced Radix™ 3D Printable Dielectrics family of products, with the first available material featuring a dielectric constant of 2.8 and low loss characteristics at microwave frequencies. These printable dielectric materials give radio frequency (RF) designers unprecedented design freedom in creating new components, eliminating the need to consider typical manufacturing design constraints.
Radix 3D Printable Dielectrics are proprietary composite materials designed for the scalable manufacture of gradient index and controlled dk 3D structures, through a scalable, high-resolution printing process for end-use RF dielectric component manufacturing. Rogers Corporation’s first Radix 3D Printable Dielectric material has a targeted dielectric constant of 2.8 and a dissipation factor of 0.0043 at 10 GHz when cured.
MAGTREX® 555 High Impedance Laminates: The first commercially available low loss laminate with controlled and matched permeability and permittivity, enabling antenna designers to expand the trade-space of their antenna design, enabling design flexibility and optimization.
Rogers technical staff will be available to discuss the most demanding applications from Phase Array Radar Antennas, high frequency magneto-dielectric materials, ablative Radome materials, and metallized-shaped/3D ADM dielectric solutions.
Conference attendees can learn about “3D-Printed E-Band Gradient Dielectric Lens for Automotive and Industrial Applications” from Trevor Polidore of Rogers Corporation and Philip Lambert of 3DFortify at the 3D Printed Lens Antennas technical session on Friday July 15th starting at 3:20 p.m.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Cadence Giving Foundation Announces Multi-Year Commitment to Expand the AI Hub at San José State University
10/13/2025 | Cadence Design Systems, Inc.The Cadence Giving Foundation today announced a multi-year commitment to expand the AI Hub at San José State University (SJSU) to equip students with the skills, hands-on training and experience needed to excel in careers in artificial intelligence (AI).
NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
10/13/2025 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking.
Sumitomo Riko Boosts Automotive Design Efficiency 10x with Ansys AI Simulation Technology
10/13/2025 | SynopsysSumitomo Riko is implementing Ansys, part of Synopsys, Inc. AI technology to accelerate time-to-solution and improve efficiency during the design and manufacturing of automotive components.
Si2 Names NVIDIA, Synopsys Technologists to Lead New LLM Benchmarking Coalition
10/10/2025 | BUSINESS WIREThe Silicon Integration Initiative today announced the chair and vice chair of the Si2 Large Language Model Benchmarking Coalition (LBC), a collaborative industry initiative and standards body advancing AI for silicon design and verification that will expedite the development of high-quality large language models for semiconductor design problems.
Quilter Secures $25M Series B to Eliminate Manual PCB Design with Physics-Driven AI
10/09/2025 | BUSINESS WIREQuilter, the first and only company to publicly demonstrate fully autonomous PCB layout through physics-driven AI, announced $25 million in Series B funding led by Index Ventures.