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Rogers to Feature Advanced Materials Technology, Capabilities for Antennas at IEEE AP-S
July 5, 2022 | Rogers CorporationEstimated reading time: 1 minute

Rogers Corporation will exhibit at the IEEE International Symposium on Antennas & Propagation (IEEE AP-S) in Denver, CO (Booth #400) on July 12-14.
The IEEE AP-S conference is intended to provide an international forum for the exchange of information on state-of-the-art research in antennas, propagation, electromagnetic engineering and radio science.
Key Rogers’ products being featured include:
Recently introduced Radix™ 3D Printable Dielectrics family of products, with the first available material featuring a dielectric constant of 2.8 and low loss characteristics at microwave frequencies. These printable dielectric materials give radio frequency (RF) designers unprecedented design freedom in creating new components, eliminating the need to consider typical manufacturing design constraints.
Radix 3D Printable Dielectrics are proprietary composite materials designed for the scalable manufacture of gradient index and controlled dk 3D structures, through a scalable, high-resolution printing process for end-use RF dielectric component manufacturing. Rogers Corporation’s first Radix 3D Printable Dielectric material has a targeted dielectric constant of 2.8 and a dissipation factor of 0.0043 at 10 GHz when cured.
MAGTREX® 555 High Impedance Laminates: The first commercially available low loss laminate with controlled and matched permeability and permittivity, enabling antenna designers to expand the trade-space of their antenna design, enabling design flexibility and optimization.
Rogers technical staff will be available to discuss the most demanding applications from Phase Array Radar Antennas, high frequency magneto-dielectric materials, ablative Radome materials, and metallized-shaped/3D ADM dielectric solutions.
Conference attendees can learn about “3D-Printed E-Band Gradient Dielectric Lens for Automotive and Industrial Applications” from Trevor Polidore of Rogers Corporation and Philip Lambert of 3DFortify at the 3D Printed Lens Antennas technical session on Friday July 15th starting at 3:20 p.m.
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RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.
The Right Blend: Mixed Wireless Technologies
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PCB East Continues to Expand
05/06/2025 | Andy Shaughnessy, Design007 MagazineIt was a perfect week for a conference and trade show in metropolitan Boston, with high temperatures in the 70s. PCB East took place at the Boxboro Regency Hotel and Conference Center April 29–May 2, with the expo on April 30. PCB East has been expanding since its relaunch a few years ago, with conference and show attendance rising each year.