-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Rogers to Feature Advanced Materials Technology, Capabilities for Antennas at IEEE AP-S
July 5, 2022 | Rogers CorporationEstimated reading time: 1 minute
Rogers Corporation will exhibit at the IEEE International Symposium on Antennas & Propagation (IEEE AP-S) in Denver, CO (Booth #400) on July 12-14.
The IEEE AP-S conference is intended to provide an international forum for the exchange of information on state-of-the-art research in antennas, propagation, electromagnetic engineering and radio science.
Key Rogers’ products being featured include:
Recently introduced Radix™ 3D Printable Dielectrics family of products, with the first available material featuring a dielectric constant of 2.8 and low loss characteristics at microwave frequencies. These printable dielectric materials give radio frequency (RF) designers unprecedented design freedom in creating new components, eliminating the need to consider typical manufacturing design constraints.
Radix 3D Printable Dielectrics are proprietary composite materials designed for the scalable manufacture of gradient index and controlled dk 3D structures, through a scalable, high-resolution printing process for end-use RF dielectric component manufacturing. Rogers Corporation’s first Radix 3D Printable Dielectric material has a targeted dielectric constant of 2.8 and a dissipation factor of 0.0043 at 10 GHz when cured.
MAGTREX® 555 High Impedance Laminates: The first commercially available low loss laminate with controlled and matched permeability and permittivity, enabling antenna designers to expand the trade-space of their antenna design, enabling design flexibility and optimization.
Rogers technical staff will be available to discuss the most demanding applications from Phase Array Radar Antennas, high frequency magneto-dielectric materials, ablative Radome materials, and metallized-shaped/3D ADM dielectric solutions.
Conference attendees can learn about “3D-Printed E-Band Gradient Dielectric Lens for Automotive and Industrial Applications” from Trevor Polidore of Rogers Corporation and Philip Lambert of 3DFortify at the 3D Printed Lens Antennas technical session on Friday July 15th starting at 3:20 p.m.
Suggested Items
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.
Hirose Launches Solution Partner Network to Address Changing Design Challenges
05/06/2024 | HiroseHirose, a leader in the design and manufacturing of innovative connector solutions, has established a Solution Partner Network that enables OEMs to quickly explore product design, specialty IP, and component fulfillment options that best suit their needs.