Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Diodes to Acquire ElevATE Semiconductor

07/15/2026 | BUSINESS WIRE
Diodes Incorporated (Diodes), announced it has entered into a definitive agreement to acquire ElevATE Semiconductor, Inc. (ElevATE) in an all-cash transaction for $250 million.

3 Key Takeaways: A New Approach to Die Topside Interconnection

07/15/2026 | I-Connect007
Every advance in power electronics places new demands on semiconductor packaging. As manufacturers push for greater power density, improved thermal management, and smaller form factors, even long-established interconnection methods deserve a fresh look. In its latest white paper, MacDermid Alpha Electronics Solutions examines how a sinter-ready copper foil solution could simplify die topside interconnection while improving performance.

Kevin Castonguay Joins MicroCare as Senior Director of Marketing

07/13/2026 | MicroCare, LLC
MicroCare LCC announced that it has hired Kevin Castonguay to serve as senior director of marketing for MicroCare.

Micron and Ford Sign Strategic Agreement to Strengthen Long-Term Memory Supply and Industry Resilience

07/08/2026 | Micron
Micron Technology, Inc. and Ford Motor Company today announced a long-term Strategic Customer Agreement (SCA) to strengthen the supply of memory and storage solutions supporting Ford’s next-generation vehicle production.

All Flex Solutions Partners with Flex Interconnect Technologies

07/07/2026 | All Flex Solutions
All Flex Solutions (“All Flex”), a leading provider of flexible printed circuit solutions, is excited to announce its partnership with Flex Interconnect Technologies (“FIT”), a Silicon Valley–based specialist in quick-turn and prototype flexible circuits.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in