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Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
In this issue, the biggest names in PCB manufacturing share their economic outlook for the upcoming year and beyond. As you will see, they were all bullish on our industry, but there was some apprehension as well. No one wants to get burned by another the supply chain disruption.
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KLA Announces Early Results of Previously Announced Cash Tender OfferJuly 6, 2022 | KLA
Estimated reading time: Less than a minute
KLA Corporation announced the early results of the previously announced cash tender offer for up to $500,000,000 aggregate principal amount of its 4.650% Senior Notes due 2024.
The Maximum Amount represents the aggregate principal amount of Notes subject to the Tender Offer and excludes any Accrued Interest or Early Tender Payment (each as defined below). The Tender Offer is being made upon the terms and subject to the conditions set forth in the Offer to Purchase, dated June 21, 2022 (as amended or supplemented from time to time, the "Offer to Purchase"), which sets forth a detailed description of the Tender Offer. The Tender Offer is open to all registered holders (individually, a "Holder" and collectively, the "Holders") of Notes.
The early results of the Tender Offer are summarized in the table below:
NOTE meets an increased demand from its customers and continues to grow. In Sweden, which is NOTE’s largest domestic market, NOTE has now signed an agreement to expand the plant in Norrtälje.
KLA Corporation announced that it has commenced a tender offer to purchase for cash up to $500,000,000 aggregate principal amount, as may be increased or decreased by KLA, of its 4.650% Senior Notes due 2024.
ASM Assembly Systems (ASM) announced that Pro-Active Engineering, Inc. (Pro-Active Engineering) has integrated an ASM high-speed line, which includes a DEK NeoHorizon screen printer and three SIPLACE TX placement platforms, into its 45,000 sq. ft. facility.
Narrowing it down to the top six was tough as there are so many challenges for today’s board designers—from incomplete information and footprint generation to power routing constraints. These are just some of my thoughts and is by no means a complete list of all of today’s design challenges.
IPC APEX EXPO week kicks off today in a first-ever virtual format. The 24-page IPC APEX EXPO program of courses and conference events details the events, technical program, keynotes, and much more.