The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
Smart Automation: AI—Revolutionizing Inspection in Electronics Manufacturing
Standard of Excellence: The Role of Technology in Enhancing the Customer Experience
MacDermid Alpha to Present High Performance Solder Alloys for Automotive Applications at HiTEN 2022
July 6, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will present its High Performance Solder Alloys for Automotive Applications at the International Conference and Exhibition on High Temperature Electronics Network (HiTEN) in Oxford, UK from the 18th-20th July.
Alan Plant, Regional Applications Manager – Europe, will deliver the paper ‘Unveiling High Performance Solder Alloys for Automotive Applications’ during the conference. Automotive powertrain related electronics systems are regularly exposed to high temperatures (>120°C) and vibration. Joining materials used in these systems must exhibit the highest level of mechanical reliability under these harsh conditions. The paper will discuss the latest advances in high performance solder alloys designed to maintain high electrochemical reliability and high thermal and electrical conductivity in these extreme temperature and vibration conditions.
MacDermid Alpha’s range of high reliability solutions for automotive applications includes; solder paste chemistries and solid solders designed for resistance to both thermo-mechanical fatigue and electrochemical migration, leading high reliability adhesives, underfills and edgebonds which provide significant mechanical reinforcement to soldered components, and Conformal Coatings that offer high levels of resistance to humidity and condensation as well as resisting the most extreme thermal shock conditions.
The HiTEN Conference is a unique forum bringing together researchers and practitioners in academia and industry, focused on all styles of practical high temperature electronics design and implementation approaches. Alan Plant’s presentation will take place on Monday 18th July at 2:45pm.
To learn more about MacDermid Alpha’s high performance solder alloys please visit MacDermidAlpha.com
Share on:
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.