-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
MacDermid Alpha to Present High Performance Solder Alloys for Automotive Applications at HiTEN 2022
July 6, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will present its High Performance Solder Alloys for Automotive Applications at the International Conference and Exhibition on High Temperature Electronics Network (HiTEN) in Oxford, UK from the 18th-20th July.
Alan Plant, Regional Applications Manager – Europe, will deliver the paper ‘Unveiling High Performance Solder Alloys for Automotive Applications’ during the conference. Automotive powertrain related electronics systems are regularly exposed to high temperatures (>120°C) and vibration. Joining materials used in these systems must exhibit the highest level of mechanical reliability under these harsh conditions. The paper will discuss the latest advances in high performance solder alloys designed to maintain high electrochemical reliability and high thermal and electrical conductivity in these extreme temperature and vibration conditions.
MacDermid Alpha’s range of high reliability solutions for automotive applications includes; solder paste chemistries and solid solders designed for resistance to both thermo-mechanical fatigue and electrochemical migration, leading high reliability adhesives, underfills and edgebonds which provide significant mechanical reinforcement to soldered components, and Conformal Coatings that offer high levels of resistance to humidity and condensation as well as resisting the most extreme thermal shock conditions.
The HiTEN Conference is a unique forum bringing together researchers and practitioners in academia and industry, focused on all styles of practical high temperature electronics design and implementation approaches. Alan Plant’s presentation will take place on Monday 18th July at 2:45pm.
To learn more about MacDermid Alpha’s high performance solder alloys please visit MacDermidAlpha.com
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.