-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
MacDermid Alpha to Present High Performance Solder Alloys for Automotive Applications at HiTEN 2022
July 6, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute

MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will present its High Performance Solder Alloys for Automotive Applications at the International Conference and Exhibition on High Temperature Electronics Network (HiTEN) in Oxford, UK from the 18th-20th July.
Alan Plant, Regional Applications Manager – Europe, will deliver the paper ‘Unveiling High Performance Solder Alloys for Automotive Applications’ during the conference. Automotive powertrain related electronics systems are regularly exposed to high temperatures (>120°C) and vibration. Joining materials used in these systems must exhibit the highest level of mechanical reliability under these harsh conditions. The paper will discuss the latest advances in high performance solder alloys designed to maintain high electrochemical reliability and high thermal and electrical conductivity in these extreme temperature and vibration conditions.
MacDermid Alpha’s range of high reliability solutions for automotive applications includes; solder paste chemistries and solid solders designed for resistance to both thermo-mechanical fatigue and electrochemical migration, leading high reliability adhesives, underfills and edgebonds which provide significant mechanical reinforcement to soldered components, and Conformal Coatings that offer high levels of resistance to humidity and condensation as well as resisting the most extreme thermal shock conditions.
The HiTEN Conference is a unique forum bringing together researchers and practitioners in academia and industry, focused on all styles of practical high temperature electronics design and implementation approaches. Alan Plant’s presentation will take place on Monday 18th July at 2:45pm.
To learn more about MacDermid Alpha’s high performance solder alloys please visit MacDermidAlpha.com
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.