The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
IPC Announces First Standards Development Task Group in Japan
July 12, 2022 | IPCEstimated reading time: 1 minute
For the first time, IPC has formed a task group in Japan. The 7-31 BV-JP IPC J-STD-001/IPC-A-610 Automotive Addendum Task Group held its first meeting on June 14, 2022, to introduce task group members, discuss the IPC Works standards collaboration platform, and create a schedule for future task group meetings.
The automotive addendum requires the use of both IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies along with requirements in the addendum, as it looks at the whole of the electronics assembly manufacturing process from assembly to inspection addressing board reliability requirements for the automotive industry. The 7-32 BV-JP task group will be guided by the principle of providing criteria to be used in addition to, and in some cases, in place of, those in the base documents to ensure the reliability of soldered electrical and electronic assemblies that must survive the automotive environment.
Members of the committee currently include the following companies: Tokai Rika (chair), Toyota Motor Corporation (vice-chair), Denso, Aisin, NSK, Panasonic, SiiX, Omron, Senju, Nihon Superior, Tamura SS, JAXA, NEC Platforms, Ltd., Harima Chemicals Group, Inc., and Japan Aviation Engineering.
Formed to enlist the input of Japan’s automotive industry, the task group encourages comments and proposals. As Yusaku Kono, IPC’s Japan representative, explains, “The goals of this group are to listen to comments from Japan’s automotive industry and to give proposals to the IPC 7-31BV global task group. The members of the group understand the value of providing feedback to strengthen IPC global standards and proactively support that goal.”
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Technica USA Named Exclusive U.S. Distributor for DCT Cleaning Products
10/14/2025 | Technica USATechnica USA is pleased to announce a strategic partnership with DCT USA, LLC, becoming the exclusive master distributor of DCT cleaning products in the United States, effective November 1, 2025.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.