-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueDon’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
Additive Manufacturing
In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Ventec Raises Global Production Capability & Control with Increased Prepreg Treating Capacity In Taiwan
July 13, 2022 | VentecEstimated reading time: 2 minutes
![](https://iconnect007.com/application/files/2616/9086/9827/Ventec.jpeg)
Ventec International Group Co., Ltd. is investing in new prepreg treating capacity at its Taiwan facility to expand its global manufacturing capability, control and supply chain flexibility. The new treating equipment, which features a specially designed impregnation system, includes multiple independent pipe work and pumping systems that will significantly minimize downtime when switching between resin systems. The upgrade is in line with Ventec’s strategy to offer high mix, quick turn supply of a wide range of specialty prepregs and laminates to its global customer base in Asia, Europe, and the United States of America.
Ventec’s latest manufacturing upgrade is designed for the production of thin-core laminates for use in the most demanding applications such as high reliability military, aerospace / space and other ultra-high reliability applications. With a capacity of up to 400,000 meters per month, the new specialist equipment can handle a wide range of glass fabrics from 1027/1037 to 7628 thanks to its superior tension control mechanism. As such it significantly ramps up Ventec’s global supply capacity directly from Taiwan for VT-901 and VT-90H polyimides as well as the full range of No Flow / Low Flow prepregs for rigid flex applications.
The new treater setup in Taiwan will be equipped with Ventec’s proprietary multiple stage filtration systems on the front end and 100% Automated Optical Inspection (AOI) for prepreg FOD-control on the back end. This ensures that all Ventec materials meet the highest standards of quality for all its customers including military & aerospace and automotive customers. Ventec’s Quality Management Systems are of course accredited with AS9100 quality standard, and conversant with applicable IPC, space agency and MIL-STD specifications.
“Taiwan is central to our strategy to drive long-term growth and expand our global leadership position,” said Jason Chung, CEO of Ventec. “The investment in Taiwan significantly increases our manufacturing capacity, drives production efficiency and accelerates the delivery of the high-reliability materials our customers demand.”
Mark Goodwin, COO EMEA & America added: “The investment in this manufacturing capacity increase at our Taiwan facility is driven by strong growth in demand for our high-reliability solutions manufactured on state-of-the-art machinery. Combined with our know-how in PCB base material technologies and our strong track record in global supply chain control, the capacity increase and multiple independent pipework design further enhances our capability to switch between resin systems quickly and efficiently. It allows us to offer high mix quick turn deliveries of a wide range of laminate and prepreg products. The front-end proprietary filtration, and backend AOI ensure, we deliver FOD free materials and can manufacture to meet the requirements of the highest standards such as IPC4101 Appendix A, for space applications.”
Additional content from Ventec International Group:
- The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates by Didier Mauve and Ian Mayoh
- The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art
- The Solutions Guide to... Thermal Management
- Roundtable Discussion: Use of IMS Thermal Materials in Multilayer Stackups for Power Applications, with Chris Hanson and Denis McCarthy of Ventec, Rax Ribadia of Excello Circuits, and Pete Starkey, I-Connect007 technical editor
- You can also view other titles in our full I-007e book library here
Suggested Items
Intel Names Naga Chandrasekaran to Lead Foundry Manufacturing and Supply Chain
07/26/2024 | IntelIntel Corporation today announced the appointment of Dr. Naga Chandrasekaran as chief global operations officer, executive vice president and general manager of Intel Foundry Manufacturing and Supply Chain organization.
TriMech is North America's Newest and Largest Provider of SolidCAM Software for CNC Manufacturing Technologies
07/26/2024 | PRNewswireTriMech has a new partnership with SolidCAM, known worldwide for its CAM (Computer-Aided Manufacturing) solution for efficient, user-friendly programming for all CNC manufacturing technologies, as well as its single-window integration and associativity with SOLIDWORKS.
Benchmark Celebrates Expansion of World-Class Facility in Brasov, Romania
07/26/2024 | PRNewswireBenchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, celebrated the opening of its significantly expanded presence in Brasov, Romania, continuing the company's investment in the region.
We Energies, Foxconn Complete Clean Energy Project in Wisconsin
07/25/2024 | FoxconnWe Energies, a Wisconsin-based utility company of WEC Energy Group, and Hon Hai Technology Group (Foxconn) are pleased to announce the completion of a solar panel installation project at Foxconn’s Science and Technology Park in Mount Pleasant, Wisconsin.
Collins Aerospace Relocating Singapore Plant to New $250M Manufacturing Facility in Seletar Aerospace Park, Singapore
07/25/2024 | Collins AerospaceCollins Aerospace, an RTX business, announced the relocation of its Singapore manufacturing facility to a new, state-of-the-art site in Seletar Aerospace Park, Singapore.