-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Ventec Raises Global Production Capability & Control with Increased Prepreg Treating Capacity In Taiwan
July 13, 2022 | VentecEstimated reading time: 2 minutes
Ventec International Group Co., Ltd. is investing in new prepreg treating capacity at its Taiwan facility to expand its global manufacturing capability, control and supply chain flexibility. The new treating equipment, which features a specially designed impregnation system, includes multiple independent pipe work and pumping systems that will significantly minimize downtime when switching between resin systems. The upgrade is in line with Ventec’s strategy to offer high mix, quick turn supply of a wide range of specialty prepregs and laminates to its global customer base in Asia, Europe, and the United States of America.
Ventec’s latest manufacturing upgrade is designed for the production of thin-core laminates for use in the most demanding applications such as high reliability military, aerospace / space and other ultra-high reliability applications. With a capacity of up to 400,000 meters per month, the new specialist equipment can handle a wide range of glass fabrics from 1027/1037 to 7628 thanks to its superior tension control mechanism. As such it significantly ramps up Ventec’s global supply capacity directly from Taiwan for VT-901 and VT-90H polyimides as well as the full range of No Flow / Low Flow prepregs for rigid flex applications.
The new treater setup in Taiwan will be equipped with Ventec’s proprietary multiple stage filtration systems on the front end and 100% Automated Optical Inspection (AOI) for prepreg FOD-control on the back end. This ensures that all Ventec materials meet the highest standards of quality for all its customers including military & aerospace and automotive customers. Ventec’s Quality Management Systems are of course accredited with AS9100 quality standard, and conversant with applicable IPC, space agency and MIL-STD specifications.
“Taiwan is central to our strategy to drive long-term growth and expand our global leadership position,” said Jason Chung, CEO of Ventec. “The investment in Taiwan significantly increases our manufacturing capacity, drives production efficiency and accelerates the delivery of the high-reliability materials our customers demand.”
Mark Goodwin, COO EMEA & America added: “The investment in this manufacturing capacity increase at our Taiwan facility is driven by strong growth in demand for our high-reliability solutions manufactured on state-of-the-art machinery. Combined with our know-how in PCB base material technologies and our strong track record in global supply chain control, the capacity increase and multiple independent pipework design further enhances our capability to switch between resin systems quickly and efficiently. It allows us to offer high mix quick turn deliveries of a wide range of laminate and prepreg products. The front-end proprietary filtration, and backend AOI ensure, we deliver FOD free materials and can manufacture to meet the requirements of the highest standards such as IPC4101 Appendix A, for space applications.”
Additional content from Ventec International Group:
- The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates by Didier Mauve and Ian Mayoh
- The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art
- The Solutions Guide to... Thermal Management
- Roundtable Discussion: Use of IMS Thermal Materials in Multilayer Stackups for Power Applications, with Chris Hanson and Denis McCarthy of Ventec, Rax Ribadia of Excello Circuits, and Pete Starkey, I-Connect007 technical editor
- You can also view other titles in our full I-007e book library here
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Hon Hai, Mitsubishi Electric Exploring Automotive Equipment Business in MOU
04/29/2026 | Hon Hai Precision Industry Co., Ltd.Hon Hai Precision Industry Co. Ltd. (Foxconn) and Mitsubishi Electric Corporation have signed a Memorandum of Understanding to explore a strategic alliance through joint operation of the automotive equipment business.
SEMIEXPO Heartland 2026 Highlights Automotive Electronics and Smart Manufacturing Innovation
04/29/2026 | SEMIThe second edition of SEMIEXPO Heartland opens this week, April 29-30 at the Detroit Marriot at the Renaissance Center in Detroit, Michigan, centered around smart manufacturing, automotive electronics, and workforce development.
Ventec Evaluates US Manufacturing Facility to Support North American Growth
04/28/2026 | Ventec International GroupVentec International Group today announced that it is evaluating the potential establishment of a manufacturing facility in the United States to support its growing North American customer base with high-performance laminate and prepreg materials.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
American Made Advocacy: Rebuilding America’s Military Stockpiles Begins With Microelectronics
04/28/2026 | Shane Whiteside -- Column: American Made AdvocacyCurrent world events demonstrate the fragility of long-distance supply chains transiting multiple zones of conflict. The U.S. military is currently drawing down supplies of key munitions and other electronic systems at unprecedented rates.1Every one of those systems is powered by printed circuit boards. The American PCB industry has kept pace with peacetime demand for the defense industry, but will now be called upon to increase production to a wartime footing at rates not seen in decades.