-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
iNEMI Recognizes Accomplishments of Project Teams
July 15, 2022 | iNEMIEstimated reading time: 1 minute
iNEMI recently recognized five project teams with the consortium’s Project Leadership Awards. This is the first year the award has been given and it recognizes project teams that have delivered in the any of the following areas:
- Superior performance of electronics manufacturing practices
- Superior technology and business results
- Positive impact on the electronics manufacturing value chain and its ecosystem
The five project teams are briefly described below; additional details are available online.
“This award recognizes the contributions and accomplishments of iNEMI project teams, specifically the individuals from our member companies who comprise these teams,” says Shekhar Chandrashekhar, iNEMI CEO. “They are doing significant work that directly benefits their own companies but also has a long-term, positive impact on the electronics manufacturing value chain.
“By working together and leveraging iNEMI’s collaborative platform, these project teams have helped their companies accelerate and reduce the risk of adopting new technologies while helping ensure supply chain readiness for the wider industry. The projects being recognized in this inaugural round of Project Leadership Awards represent the types of work at which iNEMI teams excel — development of tools, sharing of best practices, characterization of new materials and development of more efficient and/or effective test methods. Congratulations to all these teams.”
Eco-Impact Estimator, Phase 3 — Significantly updated iNEMI’s Eco-Impact Estimator tool, which helps users make better design choices earlier in the product life cycle, and they launched a web-based version of the tool at Purdue University.
Package Warpage Prediction and Characterization, Phase 5 — Characterized the material properties of organic substrate-based packages to better understand the impact of curing processes on package warpage, and derived a modelling framework to predict package warpage.
Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 3— Provided data and insights into current AOI capabilities for measuring fine line and space (
Eco-Design Best Practices for a Circular Electronics Economy — Identified and communicated eco-design best practices derived from analysis of the shared approaches taken by several leading companies that are doing innovative/beyond-compliance eco-design work.
Conformal Coating Evaluation for Improved Environmental Protection, Phase 1 — Developed and evaluated a methodology for a conformal coating evaluation test that can be completed in less than a week and executed under temperature and humidity conditions representative of those in the field, which has the potential for significant cost saving for the industry.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Global Electronics Association and CalcuQuote, an Elisa Industriq Business, Launch Joint Supply Chain Intelligence Initiative
04/29/2026 | Global Electronics AssociationThe Global Electronics Association and CalcuQuote, Elisa Industriq today announced a partnership to deliver timely, actionable supply chain intelligence for the electronics industry.
Hon Hai, Mitsubishi Electric Exploring Automotive Equipment Business in MOU
04/29/2026 | Hon Hai Precision Industry Co., Ltd.Hon Hai Precision Industry Co. Ltd. (Foxconn) and Mitsubishi Electric Corporation have signed a Memorandum of Understanding to explore a strategic alliance through joint operation of the automotive equipment business.
SEMIEXPO Heartland 2026 Highlights Automotive Electronics and Smart Manufacturing Innovation
04/29/2026 | SEMIThe second edition of SEMIEXPO Heartland opens this week, April 29-30 at the Detroit Marriot at the Renaissance Center in Detroit, Michigan, centered around smart manufacturing, automotive electronics, and workforce development.
AI Reshaping the Memory Market; Effects Spreading Across Industries
04/29/2026 | Dr. Shawn DuBravac, Global Electronics AssociationArtificial Intelligence is often framed as a software story focused on algorithms and models. But beneath that narrative lies a more fundamental shift rooted in hardware. AI is not just changing what technology can do; it’s changing how the physical components behind it are produced, allocated, and priced. One of the clearest examples of this shift is now emerging in the global memory market.
ICTC Adds Parylene Coating Capability with New KR850L System
04/28/2026 | ICTCInterconnect Cable Technologies Corporation (ICTC), a global contract manufacturer, has added in-house parylene coating capability with the installation of a new KR850L system, expanding its value-added services and giving customers a more streamlined path from build to protection.