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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
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Flexible Circuit Technologies Welcomes Senior Applications Engineer Zack Schaner
November 18, 2025 | Flexible Circuit TechnologiesEstimated reading time: Less than a minute
Flexible Circuit Technologies a Minnesota-based flexible circuit and advanced electronics contract manufacturer, welcomes Zack Schaner as Senior Applications Engineer.
In this role Zack will drive innovation in flex design and manufacturing, optimizing FCT’s diverse product offerings to deliver greater efficiency and value to clients worldwide.
Zack joins Flexible Circuit Technologies with nearly two decades of experience in design review (DFM), manufacturing, and assembly of flexible printed circuits, rigid flex, and etched foil heaters. With a strong background in application engineering and product development, he brings a deep understanding of aligning technical innovation with customer needs.
“Our world-class flex circuit design capabilities just got even stronger,” said Troy Koopman, CEO and Founder of FCT. “Zack brings decades of experience designing innovative flex and rigid-flex solutions for global clients. His deep expertise in managing complex assemblies will provide immediate value and support to our customers.”
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ASC Sunstone Expands Online Quoting to Streamline Flex PCB Procurement
02/17/2026 | ASC Sunstone CircuitsAs demand for compact, lightweight, and high-reliability electronic designs continues to grow, ASC Sunstone is making it easier for engineers to source flex circuitry with Instant Online Quoting for select Flex PCB configurations through its OneQuote® platform at sunstone.com.
UHDI Fundamentals—Foundations and Drivers of the PCB Flex: Advanced Packaging Nexus, Part 1
02/16/2026 | Anaya Vardya, American Standard CircuitsThe electronics industry is undergoing a fundamental transformation driven by demands for smaller form factors, higher performance, and greater functional integration. Two technologies sit at the center of this transformation: flexible PCBs and advanced semiconductor packaging. In this article, I’ll explore the technical foundations and key forces driving this convergence. Flexible PCBs are electrical interconnects fabricated on bendable substrates such as polyimide or polyester. Unlike rigid PCBs, flex circuits can conform to three-dimensional shapes, enabling designers to route signals through space rather than across flat planes
Flex Posts 8% Sales Growth in Q3 FY2026, Sets New Margin and EPS Records
02/10/2026 | FlexReported net sales of $7.1 billion, up 8% versus the prior year, exceeding our guidance.
Eltek Receives Purchase Orders Totaling $12.2 Million
02/09/2026 | PRNewswireEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards, announced that it received orders totaling $12.2 million from an American defense customer.
Airbus, Singapore Successfully Complete HTeaming Flight Trials
02/09/2026 | AirbusAirbus and Singapore’s Defence Science and Technology Agency (DSTA) have successfully concluded a pioneering HTeaming flight campaign at a Singapore airbase.