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Flexible Circuit Technologies Welcomes Senior Applications Engineer Zack Schaner
November 18, 2025 | Flexible Circuit TechnologiesEstimated reading time: Less than a minute
Flexible Circuit Technologies a Minnesota-based flexible circuit and advanced electronics contract manufacturer, welcomes Zack Schaner as Senior Applications Engineer.
In this role Zack will drive innovation in flex design and manufacturing, optimizing FCT’s diverse product offerings to deliver greater efficiency and value to clients worldwide.
Zack joins Flexible Circuit Technologies with nearly two decades of experience in design review (DFM), manufacturing, and assembly of flexible printed circuits, rigid flex, and etched foil heaters. With a strong background in application engineering and product development, he brings a deep understanding of aligning technical innovation with customer needs.
“Our world-class flex circuit design capabilities just got even stronger,” said Troy Koopman, CEO and Founder of FCT. “Zack brings decades of experience designing innovative flex and rigid-flex solutions for global clients. His deep expertise in managing complex assemblies will provide immediate value and support to our customers.”
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Julia McCaffrey - NCAB GroupSuggested Items
Eltek Reports Q3 2025 Financial Results
11/18/2025 | PRNewswireEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), announced its financial results for the quarter ended September 30, 2025.
Ynvisible Reports Commercial Momentum and Expanding Market Engagements in 2025/2026
11/18/2025 | Ynvisible Interactive Inc.Ynvisible Interactive Inc., a leading provider of ultra-low power printed e-paper display solutions, is pleased to provide an update on its commercial activities and market engagement for 2025.
Beyond the Board: Why More Defense Primes Are Moving Toward Rigid-flex for Lighter, More Reliable Systems
11/18/2025 | Jesse Vaughan -- Column: Beyond the BoardOver the past decade, the conversation around PCB innovation in aerospace and defense has often centered on high-density interconnects, advanced materials, and tighter design-to-fabrication collaboration. But the move toward rigid-flex is a quieter shift that has been gaining momentum, and it’s changing how primes and system integrators approach the physical architecture of mission-critical electronics.
Merlin PCB Group Invests in 2 CIMS Galaxy 25µ AOI Machines
11/13/2025 | Merlin PCB GroupThe Merlin PCB group has invested in CIMS Galaxy 25µ AOI machines, one for Merlin Flex in Hartlepool and the other for Merlin Circuit Technology in Hawarden.
Mycronic Presents the Next Level of Flexible PCB Assembly at productronica 2025
11/12/2025 | MycronicMycronic is a leading Sweden-based electronics assembly solutions provider and invites visitors to explore their next innovations and discover the factory of the future at productronica 2025, November 18–21 in Munich, at booth A3.249.