Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
Technic Releases Ceramistan 1031
July 25, 2022 | TechnicEstimated reading time: Less than a minute
Technic is pleased to announce the release of Ceramistan 1031, a pure tin electrolytic plating bath specially formulated for sensitive ceramic components, connectors, pins, and LED/MELF resistors. The Ceramistan 1031 process produces a dense, small grain deposit that provides excellent solderability, even after exposure to extended steam-age testing. The Ceramistan 1031 process offers several key cost-saving features including reduced coupling, longer bath life, and reduced oxidation.
Ceramistan 1031 also significantly reduces and can even eliminate spattering during reflow, a problem that often occurs with a standard tin bath. The process is compatible with all standard barrel and vibratory plating lines, and Technic’s patented Spouted Bed Electroplater (SBE®).
“Ceramistan 1031 has proven to be an ideal solution for applications requiring pure tin. The process performs extremely well in a full range of applications with consistent quality of the deposit and performance. With a longer bath life, reduced coupling, and reduced oxidation, Ceramistan 1031 has shown significant improvements to the quality, cost, and performance in pure tin plating for electronic applications,” says Eric Smith, R&D Chemist, Technic Advanced Technology Division.
Share on:
Suggested Items
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
PI's New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times
11/20/2024 | PRNewswirePI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.
Infineon, Quantinuum Partner to Accelerate Quantum Computing Towards Meaningful Real-world Applications
11/20/2024 | InfineonInfineon Technologies AG, a global leader in semiconductor solutions, and Quantinuum, a global leader in integrated, full-stack quantum computing, today announced a strategic partnership to develop the future generation of ion traps.
ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production
11/20/2024 | ASMPTThe high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.