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Current IssueIPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
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Next-Gen Stencil Cleaners from KYZEN at SMTA Chihuahua
July 27, 2022 | KYZEN'Estimated reading time: Less than a minute

KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Chihuahua Expo & Tech Forum, scheduled to take place Thursday, Aug. 25, 2022 at the Sheraton Chihuahua Soberano in Chihuahua, Mexico. The KYZEN team will showcase the award-winning KYZEN® E5631 and E5631J Next Generation Stencil Cleaners as well as CYBERSOLV C8882.
E5631-E5631J is a cost-effective solution that quickly and efficiently cleans all types of raw solder paste flux from stencils and A-side misprints. The stencil cleaner is designed to be used at low concentrations and ambient temperature in stencil cleaning processes including spray-in-air, understencil and ultrasonic systems.
The stencil cleaner was formulated to operate at low concentrations (<25 percent) while remaining a top performing product. E5631 provides superior and exceptional cleaning of ALL widely used assembly materials. Additionally, it rinses easily and completely thus reducing typical dry time.
CYBERSOLV C8882 is a solvent-based stencil cleaning fluid specifically designed to clean solder paste, uncured SMT adhesive and flux residue from stencils, mis-printed PCBs, stencil tools and printing squeegees. C8882 can be used in automated understencil wipe processes, hand-wipe, and ultrasonic cleaning systems as well as spray systems designed for solvent.
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