Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Next-Gen Stencil Cleaners from KYZEN at SMTA Chihuahua
July 27, 2022 | KYZEN'Estimated reading time: Less than a minute
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Chihuahua Expo & Tech Forum, scheduled to take place Thursday, Aug. 25, 2022 at the Sheraton Chihuahua Soberano in Chihuahua, Mexico. The KYZEN team will showcase the award-winning KYZEN® E5631 and E5631J Next Generation Stencil Cleaners as well as CYBERSOLV C8882.
E5631-E5631J is a cost-effective solution that quickly and efficiently cleans all types of raw solder paste flux from stencils and A-side misprints. The stencil cleaner is designed to be used at low concentrations and ambient temperature in stencil cleaning processes including spray-in-air, understencil and ultrasonic systems.
The stencil cleaner was formulated to operate at low concentrations (<25 percent) while remaining a top performing product. E5631 provides superior and exceptional cleaning of ALL widely used assembly materials. Additionally, it rinses easily and completely thus reducing typical dry time.
CYBERSOLV C8882 is a solvent-based stencil cleaning fluid specifically designed to clean solder paste, uncured SMT adhesive and flux residue from stencils, mis-printed PCBs, stencil tools and printing squeegees. C8882 can be used in automated understencil wipe processes, hand-wipe, and ultrasonic cleaning systems as well as spray systems designed for solvent.
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