-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
The Taiwanese Startup Mindtronic AI Opens the Way to the Future of Mobility With Meta-Service Ecosystem
July 29, 2022 | PRNewswireEstimated reading time: 2 minutes
Mindtronic AI, a Taiwan-based startup, unveils the world's first Meta-Service, a biometric sensing technology that provides instant access to any visible object in the real world. This technology ushers in the future of mobility, and celebrates the company's fifth CES Innovation Award win since 2018. Mindtronic AI will be showcasing its technology at the Taiwan Tech Arena Pavilion at 2022 CES.
Working with telecom companies, rental cars, and car manufacturers to deploy this new connectivity, the arrival of the Meta-Service will see the creation of a new type of data in the form of a user's instant interest. This impacts not just the automotive industry, but also consumer behavior in general in response to advertising.
Mindtronic AI has partnered up with V2X Network, an autonomous transaction platform for the mobility ecosystem, allowing its Meta-Service to learn drivers' patterns via its biometric sensing technology. It precisely predicts the driver's current interest and helps connect the Internet and local services into one combined metaverse. With its focus on activation only upon interest, users are also not at the risk of being overwhelmed.
"Originally we just made our biometric sensing technology on the road for monitoring driver's drowsiness. Today we push it further to infer driver's interest by analyzing their behaviors", said Sharon Jiang, CEO of Mindtronic AI. "The service of future mobility is transformed from physical mobility to data mobility, and the car becomes more intelligent than ever to provide passenger services proactively!"
Creating the future in flying
In addition to the Meta-Service, Mindtronic AI has been working on its automotive-grade designs built with edge-based AI deep learning for both cockpit design and sub-systems. The partnerships between the company and many automotive original equipment manufacturers (OEMs) and tier-1 suppliers in the smart cockpit and advanced driver-assistance system (ADAS) have allowed Mindtronic AI to continue refining its research and products with a view on the experiencing the future today.
The potential of a 3D immersive bio-interactive UI is clear, with Mindtronic AI's NOAH system offering a 3D digital cluster with embedded facial recognition and driving monitoring system (DMS). This can be further enhanced with a cockpit upgraded with an AI domain controller under the DIRIGENT system, and at the center of it all is the DMX system, an ADAS that can ensure safety for all. The company is also working on Omni-Fleet, its cloud intelligence system designed for preventative safety at the fleet level.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment
04/29/2026 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.
ASC’s John Johnson Bullish on the U.S. and High-tech PCBs
04/28/2026 | Marcy LaRont, I-Connect007It was a good couple of days at the SMTA UHDI Symposium in Avondale, Arizona, in early April, where John Johnson, head of technology at American Standard Circuits (ASC) and resident PCB expert on UHDI in the real-world of manufacturing, was a presenter. As the symposium ended, I visited with John, who reflected on what he considered most important and what had made the greatest impression on him.
Indium Awarded $3.2 Million DOE Grant to Establish Domestic Gallium Supply Chain
04/28/2026 | Indium CorporationIndium Corporation announced it has been awarded a $3.2 million grant by the U.S. Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation (CMEI) to develop a domestic process for recovering high-purity gallium from manufacturing by-products—a critical step toward establishing a secure, domestic supply chain for a material essential to modern defense systems, semiconductors, and advanced electronics.
Roundtable: Advanced Materials
04/27/2026 | I-Connect007 Editorial TeamDriven largely by the need for advanced chip technology for super compute ability and AI applications, low Dk, low-loss resin systems, and heavy copper laminate are attracting significant attention and global resources. There are numerous unavoidable challenges in this market that will impact manufacturers and the supply chain, and they may be hitting critical mass sooner than OEMs and fabricators think. In this roundtable discussion, moderator Marcy LaRont speaks with topic experts: Mark Goodwin, John Fix, and Ed Kelley.
Silicon Box Joins imec Automotive Chiplet Program to Strengthen Next-Gen Vehicle Supply Chains
04/22/2026 | PRNewswireSilicon Box, an industry leader in advanced semiconductor packaging solutions, announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles.