-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Dale Baker Joins Nano Dimension’s Senior Management as President of the Americas
August 4, 2022 | Nano Dimension Ltd.Estimated reading time: 2 minutes

Nano Dimension Ltd., a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional metal & ceramic Additive Manufacturing (AM) 3D printers, announced that Dale Baker will join the Company as President of Nano Dimension – Americas, where he will head the expansion of Nano Dimension’s U.S. operations as well as lead worldwide sales activity and execute on the Company’s current organic and mergers and acquisitions (M&A) growth strategy. Mr. Baker will report to Zivi Nedivi, Global President of Nano Dimension. Mr. Baker is replacing Sean Patterson, who is leaving to take a position as a COO of a printed circuit board manufacturer.
Prior to joining Nano Dimension, Mr. Baker worked at General Electric & Trading Co. LLC (GE) and in GE’s Electrical Distribution and Control business. He eventually joined GE Capital, rising to the role of Senior Vice President and Manager of the New York office for Corporate Finance, responsible for investing in M&A transactions for the U.S. based manufacturing businesses. Mr. Baker also has served as the CEO or President of seven companies, two of which were early stage and achieved high growth with annual revenues reaching more than $350 million each. During his career, he has been involved in the acquisition and subsequent integration of over twenty-five companies.
Mr. Baker graduated from Virginia Tech with a Bachelor of Science in Mechanical Engineering and from Duke University with a Master’s in Business Administration.
“I am excited by the opportunity to impact the Additive Manufacturing and electronic manufacturing industries, leading Nano Dimension to revolutionize Industry 4.0 by digitizing supply chain activities and converting manufacturing into a neural network of edge-devices – enabling customers to manufacture, print, inject – when and where needed,” commented Mr. Baker. “I am not only excited about the opportunity, but also by the actions they have already taken, the foundation they have built, and the vision which we shall make a reality.”
Zivi Nedivi, President of Nano Dimension, added, “I wish Sean good luck and much success. In parallel, I am very excited that Dale has agreed to leave his previous CEO role and is now joining Nano Dimension. Yoav Stern, Nano Dimension’s CEO, and I have been doing business with Dale for more than 20 years. Only a few years ago, Dale was working with me as Chief Operating Officer, successfully turning around a U.S. public specialty chemical company. Through his extensive career at GE and later as a CEO of numerous large public and private companies, Dale has always been a leader at every point in his career. I am convinced that he will be a substantial quality enhancer and will be a major driving force in our growth.”
Suggested Items
Compal Announces Completion of New Automotive Electronics Facility in Poland, Signaling Strategic Growth in Europe
06/30/2025 | Compal Electronics Inc.Compal Electronics is proud to announce the completion of Phase One of its new manufacturing facility in Czeladź, Silesian Voivodeship, Poland, marking a major milestone in its strategic expansion into the European automotive electronics market.
Leadership Development Continues at Incap Slovakia
06/30/2025 | IncapIncap Slovakia has launched the first leadership development training of 2025 as part of its ongoing Team Leaders Academy programme.
Incap Estonia Recognized with Second Golden Label for Responsible Business
06/27/2025 | IncapIncap Electronics Estonia has been awarded a golden label by the Responsible Business Forum in Estonia for the second time. The responsible business label is a prestigious symbol in Estonia that identifies entrepreneurs and organisations that demonstrate excellence in environmental, social, and economic responsibility.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.
TT Electronics Achieves ISO 13485 Medical Certification at Mexicali EMS Facility
06/27/2025 | TT ElectronicsThis milestone underscores TT Electronics’ commitment to delivering high-quality, compliant, and reliable manufacturing solutions to its global customers in healthcare and life sciences.