The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
Smart Automation: AI—Revolutionizing Inspection in Electronics Manufacturing
Standard of Excellence: The Role of Technology in Enhancing the Customer Experience
MacDermid Alpha to Showcase Latest Circuit Board Assembly Innovations at Upcoming SMTA Expos
August 10, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will highlight its range of advanced solutions for circuit board assembly at the upcoming SMTA Queretaro Expo, Mexico on August 18, SMTA Ohio Expo, USA on August 24 and SMTA Chihuahua Expo on August 25.
MacDermid Alpha’s latest low temperature innovation, ALPHA OM-565 HRL3 solder paste, will be a highlight at all three SMTA Expos. The paste is designed to minimize warpage induced defects and enhance product reliability compared to existing low temperature solutions. At the SMTA Chihuahua Expo, Francisco Gallegos, Customer Technical Support Engineer – Mexico, will present a paper on this topic with ‘Low Temperature Soldering: Traditional Sn-Bi alloys and Latest Developments in High Reliability Alloys for SMT and PTH Applications’.
Additionally, MacDermid Alpha will promote the ALPHA HiTech range of adhesives, underfills, edgebonds and encapsulants. These epoxy-based materials provide reinforcement and protection for soldered assembled components, enhancing reliability. Sustainability initiatives will also be a key focus, with emphasis on MacDermid Alpha’s Reclaim and Recycling Services. Offering safe and efficient recycling services, this service helps companies meet their environmental and legislative requirements, and at the same time, maximize the value of their waste streams.
2022 is an important milestone for MacDermid Alpha with the business celebrating 250 years of combined innovation. The MacDermid brand is celebrating 100 years of supplying specialty chemical solutions for the most complex printed circuit board and IC substrate designs. The Alpha brand is celebrating 150 years of providing high performance component attachment materials for the electronics assembly industry.
To learn more about MacDermid Alpha’s circuit board assembly solutions please visit: macdermidalpha.com.
Download The Printed Circuit Assembler’s Guide to… Low-Temperature Soldering by Morgana Ribas. You can also view other titles in our full I-007eBooks library.
Share on:
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.