-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Nordson Board of Directors Increases Dividend 27 Percent, Marking 59 Consecutive Years of Annual Increases
August 10, 2022 | Nordson CorporationEstimated reading time: 1 minute
Nordson Corporation announced that its Board of Directors has approved a 27 percent increase in the Company’s quarterly cash dividend to $0.65 per common share from $0.51. The dividend is payable on September 6, 2022, to shareholders of record as of the close of business on August 23, 2022.
This increase represents Nordson’s 59th consecutive year of annual dividend increases, ranking it among an elite group of publicly traded companies with the longest-running record of consecutive dividend increases.
“Nordson has a proud history of returning a portion of its cash flow to our shareholders. This increase moves our annual dividend yield to slightly over one percent,” said Joseph Kelley, executive vice president and chief financial officer. “This increase reflects our confidence in our long-term profitable growth, which is driven by the continued execution of our Ascend strategy, designed to deliver top-tier growth with leading margins and returns.”
Nordson Corporation is an innovative precision technology company that leverages a scalable growth framework through an entrepreneurial, division-led organization to deliver top tier growth with leading margins and returns. The Company’s direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end market exposure includes consumer non-durable, medical, electronics and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries.
Suggested Items
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
indie Semiconductor Launches Advanced Smart Connectivity Solutions for In-Cabin Applications
04/23/2024 | indie Semiconductorindie Semiconductor, Inc., an Autotech solutions innovator, has introduced a family of new high-performance video converters and retimers to enable in-cabin connectivity applications, including audio and video transport and device interfacing.
IDTechEx Discusses the Role of Printed Sensors in Mass-Digitization
04/11/2024 | PRNewswireIntegrated sensors digitizing physical interactions are vital in everyday life. From personalized user experiences to warehouse inventory management, data-driven insights are driving demand for smarter sensors — and lots of them.
MKS Introduces ESI Geode G2 CO2 Laser System for High- Precision and High-Speed HDI and mSap Via Drilling
04/09/2024 | MKS Instruments, Inc.MKS Instruments, Inc., a global provider of technologies that transform our world, today announced the official launch of the ESI Geode™ G2 laser drill system, the next generation of the Geode™ platform for processing PCB and ICP materials.
DuPont Unveils Pyralux ML Laminate Series, Offering High Thermal Management for Extreme Environments
04/09/2024 | DuPontDuPont introduced the DuPont™ Pyralux® ML Series of double-sided metal-clad laminates, a unique addition to its extensive family of Pyralux® laminates for flexible and rigid-flex printed circuit boards (PCBs).