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TRI to Join the SMTA Guadalajara Expo 2022
August 12, 2022 | Test Research Inc.Estimated reading time: Less than a minute
Test Research, Inc. (TRI) will join the SMTA Guadalajara Expo 2022 to showcase our award-winning Inspection solutions for the SMT industry. Visit booth #103 at the SMTA Expo Guadalajara from September 21 to September 22, 2022, to learn more about the latest innovations in 3D SPI, 3D AOI, 3D AXI, and multicore ICT.
Presenting an integrated solution for the PCBA production line, TRI will exhibit our Global Technology Award-winning TR7007QI 3D SPI solution. Furthermore, TRI will showcase our Multi-Angle 3D AOI solution TR7500QE and TRI's Automated 3D X-Ray Inspection solution demo.
TRI's Optical Inspection platforms are capable of metrology measurements and AI-powered Inspection algorithms, enable big data, and improve data traceability, which is essential for promoting a Smart Factory environment. TRI solutions comply with most Industry 4.0 standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
Visit TRI’s Booth No.103 at SMTA Guadalajara Expo 2022. Our expert staff is ready to discuss our entire one-stop solution for ensuring PCBA production quality in a smart factory manufacturing environment.
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TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.
Building Industry-ready Talent Through Standards-based Education
04/27/2026 | Global Electronics AssociationRecently, Sichuan Modern Vocational College organized 132 students to complete IPC-A-610 Acceptability of Electronic Assemblies Certified IPC Specialist (CIS) training and certification.
Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies
04/27/2026 | Nolan Johnson, I-Connect007This multi-expert roundtable explores cybersecurity measures specific to electronics manufacturing. NEC’s Watanabe Hiroyaki, Divyash Patel, CEO of MX2 Technologies, and Ali Pabrai, CEO at EC First, join moderator Nolan Johnson for a deeper discussion on cybersecurity certifications.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
04/21/2026 | Steve Williams -- Column: The Right ApproachThe Defense Logistics Agency has initiated formal proceedings to cancel the military's primary performance specification for printed circuit boards, a move that could reshape how the U.S. defense industrial base qualifies and sources one of its most critical electronic components. On March 4, 2026, DLA Weapons Support issued a memorandum to military and industry coordination activities announcing that MIL-PRF-31032, along with its six associated specification sheets, has been proposed for cancellation. A 30-day comment period was allotted, with concurrence or comments due by April 3, 2026.