Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
iNEMI’s Call-for-Participation Webinar: Development of an Imaging AOI + AI Ecosystem
August 17, 2022 | iNEMIEstimated reading time: 1 minute
iNEMI’s Development of an Imaging AOI + AI Ecosystem project will address the electronics manufacturing industry’s need for comprehensive image libraries (data sets) to train AI models for AOI and AXI. Insufficient data can result in inaccurate AI models for image classification. Presently, companies such as electronic manufacturing services (EMS) providers maintain their own image data, which is private and isolated. The collection of image data — data acquisition, identification, labeling, etc. — is time consuming and there is currently no collaboration model in the industry for sharing image data that can balance benefits with risk mitigation.
This project will evaluate and propose an ecosystem collaboration model for the electronics manufacturing industry to collect and share image data from collaborating companies in a commonly acceptable protocol. The data sets will be contributed to a central data repository where data is consolidated into different categories/types and can provide valuable input for AI training cycles. The initial focus of the project will be on the EMS sector, which could benefit quickly from leveraging more data to enhance their AOI capabilities.
The project team will investigate technical, business and security issues with the aim of developing an acceptable protocol and business model that will allow for the appropriate level of sharing of images to enhance manufacturing capability without impinging on intellectual property or confidentiality.
Registration
Join us for this call-for-participation webinar to understand how the Development of an Imaging AOI + AI Ecosystem project can benefit your organization. Two sessions are scheduled (with the same content) and the webinar is open to industry.
Session 1: Thursday, September 1
10:00-11:00 a.m. EDT (U.S)
4:00-5:00 p.m. CEST (Europe)
10:00-11:00 p.m. CST (China)
Session 2: Thursday, September 2
9:00-10:00 a.m. CST (China)
9:00-10:00 p.m. EDT (U.S.) on September 1
Register for this webinar on iNEMI’s website.
Share on:
Suggested Items
Real Time with... IPC APEX EXPO 2025: Tariffs and Supply Chains in U.S. Electronics Manufacturing
04/01/2025 | Real Time with...IPC APEX EXPOChris Mitchell, VP of Global Government Relations for IPC, discusses IPC's concerns about tariffs on copper and their impact on U.S. electronics manufacturing. He emphasizes the complexity of supply chains and the need for policymakers to understand their effects.
UMC Unveils New Fab Expansion in Singapore in Grand Opening Ceremony
04/01/2025 | BUSINESS WIREUnited Microelectronics Corporation (UMC), a leading global semiconductor foundry, today officially unveiled its new fab facility in Singapore in a grand opening ceremony.
Real Time with... IPC APEX EXPO 2025: Revitalizing the U.S. Microelectronics Industry with PCBAA
04/01/2025 | Real Time with...IPC APEX EXPOPCBAA president David Schild discusses his experience in the PCB and aerospace sectors, focusing on the mission of the PCBAA and its collaboration with IPC. He highlights the decline in PCB manufacturing in the U.S. and the importance of public policy in restoring capacity.
Do You Have X-ray Vision? SMT007 Magazine April Issue Is No Joke
04/01/2025 | I-Connect007 Editorial TeamAs component packaging continues to evolve, the capability of inspecting through components is crucial. Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question—and others—to bring more efficiency to your bottom line.
New Accenture Siemens Business Group to Reinvent Engineering and Manufacturing for Clients
03/31/2025 | BUSINESS WIRESiemens and Accenture are significantly advancing their long-standing alliance partnership to help clients reinvent and transform engineering and manufacturing.